NXP PMIC - Power Management - Spezialisiert
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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 14/20
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Anwendungen | Stromversorgung | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
FS4500 |
7.128 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
3.096 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
5.850 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 206MAPBGA |
2.862 |
|
- | General Purpose | - | 1.8V ~ 4.5V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (13x13) |
|
|
|
NXP |
IC POWER MANAGEMENT |
3.636 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
6.102 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
6.516 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
4.644 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8.244 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8.946 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8.028 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
FS6500 |
4.824 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SBC, DCDC 1.5A VCORE FS1B CAN,15 |
7.596 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC ENGINE CTRL SW/DVR 54-SOIC |
6.642 |
|
- | Automotive | 10mA | 5V ~ 36V | -40°C ~ 125°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC-EP |
|
|
|
NXP |
FS6500 |
5.994 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8.964 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS6500 |
3.384 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
4.626 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS4500 |
6.066 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
5.922 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7.848 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
4.284 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7.236 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT LS1046A |
5.256 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
1.292 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
108 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7.614 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
FS6500 |
2.826 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS6500 |
3.472 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
2.502 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |