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NXP PMIC - Power Management - Spezialisiert

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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 20/20
Bild
Teilenummer
Hersteller
Beschreibung
Auf Lager
Menge
Serie
Anwendungen
Stromversorgung
Spannung - Versorgung
Betriebstemperatur
Montagetyp
Paket / Fall
Lieferantengerätepaket
MC33909L5AD
NXP
SBC 5V 1CAN 1LIN 6SG HLQFP48
5.436
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909L5ADR2
NXP
SBC 3V 1CAN 0LIN 6SG HLQFP48
7.470
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909N3AD
NXP
SBC 3V 1CAN 0LIN 6SG HLQFP48
5.742
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909N3ADR2
NXP
SBC 3V 1CAN 0LIN 6SG HLQFP48
5.418
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909N5AD
NXP
SBC SG 1 CAN 0 LIN HLQFP48
2.970
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909N5ADR2
NXP
SBC SG 1 CAN 0 LIN HLQFP48
7.830
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909Q3AD
NXP
SBC 3V 1CAN 0LIN 6SG HLQFP48
7.416
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909Q3ADR2
NXP
SBC 3V 1CAN 0LIN 6SG HLQFP48
7.920
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909Q5AD
NXP
SBC 5V 1CAN 4LIN 6SG HLQFP48
5.976
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33909Q5ADR2
NXP
SBC 5V 1CAN 4LIN 6SG HLQFP48
5.922
-
System Basis Chip
7mA
3.5V ~ 28V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC34PF1550A0EP
NXP
POWER MANAGEMENT IC 3 BUCK REGS
5.958
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8V ~ 7V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-HVQFN (5x5)
MC34PF1550A0EPR2
NXP
POWER MANAGEMENT IC 3 BUCK REGS
3.798
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8V ~ 7V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-HVQFN (5x5)
MWCT1013VLHST
NXP
32BIT256K FLASHSTR CTM
3.060
-
General Purpose
-
2.7V ~ 3.6V
-40°C ~ 105°C (TA)
Surface Mount
64-LQFP
64-LQFP (10x10)
MWCT1013VLHSTR
NXP
32BIT256K FLASHSTR CTM
7.758
-
General Purpose
-
2.7V ~ 3.6V
-40°C ~ 105°C (TA)
Surface Mount
64-LQFP
64-LQFP (10x10)
NX1A4WPZ
NXP
IC WIRELESS PWR RECEIVER WLCSP42
4.554
-
Wireless Power Receiver
12mA
6.1V ~ 18V
-40°C ~ 85°C
Surface Mount
42-UFBGA, WLCSP
42-WLCSP (3.56x3.41)
NX1WP10Z
NXP
IC WIRELESS PWR RECEIVER WLCSP42
3.690
-
Wireless Power Receiver
-
-
-40°C ~ 85°C
Surface Mount
42-UFBGA, WLCSP
42-WLCSP (3.56x3.41)
NX2A4WPZ
NXP
IC WIRELESS PWR RECEIVER
6.030
-
Wireless Power Receiver
12mA
6.1V ~ 18V
-40°C ~ 85°C
Surface Mount
42-UFBGA, WLCSP
42-WLCSP (3.56x3.41)
MC33PF8100CGES
NXP
IC POWER MANAGEMENT I.MX8QM
3.384
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CDEP
NXP
IC POWER MANAGEMENT I.MX8QM
3.366
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CEEP
NXP
IC POWER MANAGEMENT I.MX8QM
2.376
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8100CFEP
NXP
IC POWER MANAGEMENT I.MX8QXP
8.532
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC34PF8100CGEP
NXP
IC POWER MANAGEMENT I.MX8QM
6.264
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8200CLES
NXP
IC POWER MANAGEMENT
3.582
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8200DAES
NXP
IC POWER MANAGEMENT I.MX8QM
3.472
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33PF8200DGES
NXP
IC POWER MANAGEMENT I.MX8QM
4.392
-
High Performance i.MX 8, S32x Processor Based
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)