Technology Articles

2023-12 Semiconductors Honeywell Aerospace

[Dez 12 2023] Honeywell made the announcement that it will hand over its first batch of battery energy storage systems (BESS) to VIElectron, a CB Loranger Company. These BESS will be distributed to six solar parks that are strategically located throughout the United States Virgin Islands. As soon as they are finished, the solar array and BESS will satisfy thirty percent of the islands’ energy consumption throu ...

2023-12 Semiconductors Omron Electronics Inc-EMC Div

[Dez 12 2023] OmniOn Power has added a new NE070DC58AZ DC/DC converter to its tested and dependable Infinity product family, catering to clients seeking increased versatility in powering radio equipment atop cell towers. The most recent additions to the Infinity-series product family increase and regulate the nominal direct current (DC) plant voltage from -48 VDC to -58 VDC, which is typically supplied by an I ...

2023-12 Semiconductors Aavid

[Dez 11 2023] UKRI’s Faraday Battery Challenge has granted financial support to Eatron Technologies and About:Energy in order to develop an innovative decision engine powered by artificial intelligence. This engine is expected to extend battery lifespans, shorten time-to-market, and solidify the United Kingdom’s standing as a worldwide frontrunner in intelligent battery management systems powered by AI. Presen ...

2023-12 Semiconductors STMicroelectronics

[Dez 11 2023] MasterGaN1L and MasterGaN4L from STMicroelectronics represent the next iteration of integrated gallium nitride (GaN) bridge devices that streamline the design of power supplies by utilizing wide-bandgap technology to meet the most recent ecodesign objectives. The MasterGaN family from ST comprises high electron-mobility transistors (HEMT) made of 650V GaN. It includes system protection, optimized ...

2023-12 Semiconductors Intel

[Dez 8 2023] Intel disclosed that its technology is assisting in the operation of the new energy grid modernization solution developed by the Edge for Smart Secondary Substations (E4S) Alliance. The E4S solution facilitates the transition from a closed-hardware, proprietary architecture to a software-defined energy system that is flexible, open-ended, and disruptive to the existing system. Over seventeen mill ...

2023-12 Connectors Bourns

[Dez 8 2023] A new series of air coil inductors introduced by Bourns features a high Q, a high self-resonant frequency, and a strict inductance tolerance. The AC4842R Air Coil Inductor Series from Bourns provides a low-loss, high-frequency solution that expands the selection of high-Q options available to RF application designers. With an inductance ranging from 22 to 150 nanohenry (nH) and a minimum Q value ...

2023-12 Semiconductors Texas Instruments

[Dez 7 2023] In Lehi, Utah, Texas Instruments initiated construction on its 300-mm semiconductor wafer production facility (or “fab”). TI President and Chief Executive Officer Haviv Ilan, accompanied by state and local elected officials, community leaders, and Utah Governor Spencer Cox, witnessed the inaugural stages of construction for the 300-mm wafer fab LFAB2, which will be linked to the organization’s cu ...

2023-12 Semiconductors Taiwan Semiconductor Corporation

[Dez 7 2023] Vanguard International Semiconductor (VIS), a subsidiary of Taiwan Semiconductor Manufacturing Co. (TSMC), is reportedly nearing a decision to build its most advanced semiconductor manufacturing facility in Singapore, according to sources with knowledge of the situation. VIS, a specialty contract chipmaker in which TSMC possesses a 28.3% stake, intends to construct its first 12-inch chip plant in ...

2023-12 Passive Components Rohm Semiconductor

[Dez 6 2023] ROHM Semiconductor has announced the new silicon capacitors BTD1RVFL series. Smartphones and wearable devices will progressively incorporate these components. Silicon semiconductor processing technology has been refined over many years, allowing for greater efficacy in a more compact package. Smartphones and other devices with growing functionality require smaller components that support high-den ...

2023-12 Semiconductors Taiwan Semiconductor Corporation

[Dez 6 2023] Taiwan Semiconductor unveils its new TESD Series of single-channel ESD clamping diodes with optimized size and performance for wearable applications. The novel design of the new TESD devices includes bidirectional restraining cells (for ESD protection up to ±30kV) housed in an ultra-compact DFN0603 package. The devices in the new TESD Series are available in versions with 5.0V and 3.3V (maximum) ...

2023-12 Semiconductors Infineon Technologies

[Dez 5 2023] Infineon Technologies AG has announced the addition of a new industry-standard package to its CoolSiC 1200 V and 2000 V MOSFET module family. It uses a proven 62 mm device half-bridge topology design and is based on the newly introduced enhanced M1H silicon carbide (SiC) MOSFET technology. The package enables SiC to be used in mid-power class applications above 250 kW, where conventional IGBT sil ...

2023-12 Semiconductors Acme Electric/Amveco/Actown

[Dez 5 2023] With the rise of the Internet of Things (IoT) and the growing popularity of digital technologies, our reliance on connectivity has grown exponentially. This surge in demand has driven the rapid development of wireless communication technology. The Wi-Fi Alliance issued the Wi-Fi CERTIFIED HaLow certification in November 2021, which is a disruptive innovation in the field. This variant of Wi-Fi, w ...