Technology Articles

2023-11 Semiconductors NXP

[Nov 24 2023] NXP Semiconductors announces the S32M2, further expanding the S32 automotive computing platform. Dedicated motor control solutions are optimized to effectively improve the efficiency of automotive applications such as pumps, fans, sunroof and seat positions, seat belt preteners, and backup doors. The S32M2 is based on the S12 MagniV portfolio and combines NXP's motor control technology experience ...

2023-11 Power Intel

[Nov 24 2023] Intel's Climate Transformation Action Plan details Intel's path to reducing its carbon footprint. Accompanying the announcement was a letter from Intel CEO Pat Kissinger detailing the report and outlining Intel's commitment to advancing sustainable business practices. The world is expanding rapidly, and computing power has become the foundation for more opportunities and a better future for every ...

2023-11 Power Infineon Technologies

[Nov 22 2023] Infineon Technologies AG, a semiconductor leader in spherical power systems and the Internet of Things, and Archetype AI, a pioneer of AI in the physical world, have signed a strategic cooperation agreement to accelerate the development of AI-enabled sensor chips that will make people's lives easier, safer and more environmentally friendly. Archetype AI, based in Silicon Valley, is a cutting-edge ...

2023-11 Power Nexperia

[Nov 22 2023] Nexperia announced a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFET discrete products. Nexperia and Mitsubishi Electric, both leaders in their respective industries, have teamed up to develop technologies that will drive the energy efficiency and performance of SiC wide band gap semiconductors to new heights, while meeting the rapidly gr ...

2023-11 Power Infineon Technologies

[Nov 20 2023] Electric grippers offer precise control, adaptability, safety, and energy efficiency, making them indispensable in industries that require handling delicate components with accuracy. Robotic arms significantly enhance the productivity and security of industrial production lines. Traditional pneumatic grippers hinder the implementation of a more intelligent and sustainable manufacturing future, ne ...

2023-11 Semiconductors STMicroelectronics

[Nov 20 2023] STMicroelectronics has introduced the 32-pin, dual-inline, molded, through-hole ACEPACK DMT-32 family of SiC power modules for automotive applications. Designed for systems such as onboard chargers (OBC), DC/DC converters, fluid pumps, and air conditioning, these components feature a high-power density, a very compact design, and a simplified assembly process. The product family provides system d ...

2023-11 Connectors Renesas Electronics America

[Nov 16 2023] Renesas has pre-announced information about the fifth-generation R-Car SoC for high-performance applications, which uses advanced Chiplet small chip package integration technology to bring greater design flexibility to vehicle engineers. For example, if advanced driver assistance systems (ADAS) need to accommodate more prominent AI performance, engineers can integrate AI accelerators into a singl ...

2023-11 Sensors Littelfuse

[Nov 16 2023] Littelfuse Corporation is an industrial technology manufacturing company dedicated to powering a sustainable, connected and safer world. The company announced the launch of its latest innovation, the 59001 magnetic spring sensor. This miniature D-shaped cylindrical magnetic spring sensor combines compact size, high performance and customization options to make it ideal for a wide range of industr ...

2023-11 Power Intel

[Nov 14 2023] Intel CEO Pat Kissinger said that Intel will complete its "four years, five process nodes" plan as planned or ahead of schedule, and the progress Intel has made in process technology is fully recognized by third parties. In July 2021, Intel announced its "Five Process Nodes in Four Years" plan to regain process leadership by 2025 by advancing five process nodes - Intel 7, Intel 4, Intel 3, Intel ...

2023-11 Connectors Microchip Technology

[Nov 14 2023] The rise of generative AI and AI/ML technologies has created new demands for faster connectivity, driving 800G connectivity for back-end data center networks and applications. Using active electronic cables (AEC) is currently the most effective solution, but cable providers need to overcome a number of design and development hurdles. To address this issue, Microchip Technology announced the launc ...

2023-11 Power Molex

[Nov 13 2023] Molex, the global leader and connectivity innovator in the electronics industry, has released the results of a global reliability survey that reveals the challenges faced by hardware (including devices) system architects and design engineers in balancing increasing reliability expectations with increasing product complexity, reduced test times, and ongoing cost and manufacturing constraints. Howe ...

2023-11 Semiconductors NXP

[Nov 13 2023] NXP Semiconductors announces the AW693, a new wireless connectivity solution at the automotive scale. Designed for the car, the AW693 is part of NXP's most complete automotive wireless connectivity portfolio, enabling concurrent dual MAC Wi-Fi 6E and Bluetooth 5.3 with LE Audio connectivity, and is protected by NXP's integrated Edgelock security subsystem to provide multiple secure connections in ...