Industrial and automotive MOSFEts in TSOP6F packaging

Toshiba's TSOP6F encapsulated mosFeTs provide power density and performance in small packages. These products are suitable for applications such as motor control in consumer and industrial equipment. In addition, AEC-Q101 compliance makes the product suitable for automotive and other high reliability applications. Range is -40 V to 100 V with N channel and P channel options and RDS(ON) as low as 12 mΩ

These products use Toshiba's UMOS process and have low on-resistance. In addition, the TSOP6F package extends the mounting capability of the chip with its flat leads, reducing the thermal resistance of the chip. Therefore, the power dissipation of the product is 1.5W, which helps to reduce the energy consumption of the equipment.

Features

● Small TSOP6F Package: 2.9mm x 2.8mm x 0.80mm (typical value)
● High allowable power dissipation rating: PD= 1.5W
● Reduce energy consumption through low on-resistance:
● Wide VDSS, from 20 V to 100 V
● VGS = 4.5V RDS(ON) = 32.5mΩ (max) (SSM6K824R)
● VGS = -4.5V RDS(ON) = 73 mΩ (max) (SSM6J825R)

Applications

● Motor control circuit (power management switch)
● Automotive equipment (headlights, turn signals, daytime running lights, etc.)
● Consumer electronic equipment
● Industrial equipment
● LED application
● Lighting application