Technology Articles

2012-05 Power TDK

[Mai 7 2012] TDK Corporation has developed the SMG3B series of mSATA small SSD modules that support serial ATA 3Gbps. The SMG3B series is an mSATA interface that achieves a maximum capacity of 64GByte on an area of about 30mm×50mm. High speed MSATA-type compact flash memory module with effective speed up to 170MByte/s. mSATA is a standard developed by the Serial ATA International Organization (SATA IO) and or ...

2012-05 Semiconductors NXP

[Mai 6 2012] NXP Semiconductors N.V. announced the launch of SSL2109, a high-efficiency step-down controller for high-power, non-dimming LED lighting applications using a non-isolated topology. Used in conjunction with external power switches, the SSL2109 LED driver IC provides a single design platform for 100V, 120V and 230V power input voltages and power ranges up to 25 W. SSL2109 offers a controller-only v ...

2012-05 Passive Components Vishay

[Mai 5 2012] Vishay Intertechnology has announced the launch of its new generation TrenchFET Gen IV Series 30V N-channel power MOSFET devices -SiRA00DP, SiRA02DP, SiRA04DP and SiSA04DN. All four devices feature a new high-density design with on-resistance as low as 1.35mΩ at 4.5V and Miller charge Qgd as low as 1.8nC in PowerPAK SO-8 and 1212-8 packages. The new Vishay Siliconix TrenchFET IV incorporates a nu ...

2012-05 Semiconductors Microsemi

[Mai 4 2012] Microsemi Corporation introduces a set of system and power management design tools for high-availability wired and wireless communications infrastructure devices. New design tools include the Mixed Signal Power Manager (MPM) 4.0 reference design, which supports up to 64 power rails and mixed analog and digital point-of-loads (POL), as well as PMBus -based communication. The company also offers a ...

2012-05 Passive Components Diodes Incorporated

[Mai 3 2012] Diodes Incorporated introduces a range of high-efficiency N-channel and P-channel MOSFETs in thin DFN2020-6 packages. DFN2020H4 package DMP2039UFDE4, the height from the board is only 0.4 mm, the board area is only four square millimeters, is a P-channel device with a fixed voltage of -25V, the volume is 50% thinner than similar devices. The other MOSFETs in the same series using the DFN2020E pac ...

2012-05 Semiconductors NXP

[Mai 2 2012] NXP Semiconductors has released the new SOT1226 "Diamond" package, the world's smallest general-purpose logic package with a unique pad spacing design. Measuring just 0.8 x 0.8 x 0.35-mm, the new SOT1226 comes in a pin-free plastic package that is 25% smaller than the previous world's smallest logic package, the NXP SOT1115. Despite its smaller size, the SOT1226 has a pad spacing of 0.5-mm, which ...

2012-05 Passive Components Vishay

[Mai 1 2012] Vishay Intertechnology has announced the launch of the first component of its next-generation D-series high-voltage power MOSFETs. The new 400V, 500V, and 600V N-channel devices feature low on-resistance, ultra-low gate charge, and 3A to 36A currents in a variety of packages. The D-Series MOSFETs are based on a new high-voltage strip technology that enables new levels of efficiency and power dens ...

2012-04 Connectors Renesas Electronics America

[Apr 30 2012] Renesas Mobile Corporation, a subsidiary of Renesas Electronics, a provider of advanced wireless communications semiconductor solutions and platforms, will show you: With its "smarter by design" architecture, how its world-leading SP2531 LTE triple mode modem expands performance to nearly 150Mbps in downloads to deliver LTE CAT-4 performance. The show, co-hosted with Ericsson, a leading provider ...

2012-04 Connectors Renesas Electronics America

[Apr 29 2012] Intersil Corporation today announced the launch of the world's lowest-cost PICo-QHD Pico projector system and the industry's smallest LED-based LCoS PICo projector solution that has reached production readiness. Developed for low-power and cost-sensitive embedded or companion Pico projector applications, Intersil PICO-QHD offers a fully integrated reference design that includes high-volume produc ...

2012-04 Connectors Analog Devices

[Apr 28 2012] Analog Devices, Inc. recently introduced the ADP1046, a digital power controller for high-efficiency AC-DC and isolated DC-DC power systems. The ADP1046 is a flexible controller with 7 PWM (pulse width modulation) logic outputs that can be easily programmed via an I2C interface and an easy-to-use graphical user interface (GUI). The device can be used to control and drive most power supply topolog ...

2012-04 Passive Components TDK

[Apr 27 2012] TDK Corporation has developed TDK laminated ceramic chip capacitors for in-vehicle, X8R characteristics and announced the start of mass production and sales from April 2012. Through the development of dielectric materials that maintain excellent reliability and temperature characteristics even in the harsh temperature environment of 150 ° C, the electrical capacity of the product was successfully ...

2012-04 Power Vishay

[Apr 26 2012] Vishay Intertechnology, Inc. announced the introduction of two infrared receivers specifically developed for general purpose 3D television glasses, the TSMP6000 and TSMP77000, expanding its optoelectronics portfolio. Most LCD 3D TVS sold on the market today use shutter glasses that separate the images from the left and right eyes. Despite many efforts to standardize the technology used to synchro ...