Technology Articles
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ARM launches iot Starter Kit to start a new generation of smart devices connected to the cloud
2015-03
Power
Aries Electronics
[Mär 7 2015] ARM today announced the launch of the ARM® mbed™ IoT Starter Kit, which uses Ethernet connectivity technology to transfer data from connected devices directly to IBM's Bluemix cloud platform. The secure sensing environment provided by ARM, combined with IBM's cloud data analytics, mobile and application resources, will accelerate the development of new smart device prototypes and special value-ad ...
ST's best-in-class NFC tag will enable secure and convenient iot connectivity
2015-03
Power
STMicroelectronics
[Mär 6 2015] STMicroelectronics SRTAG NFC/RFID tags have the widest storage range in the market, the longest data retention period, the highest number of rewrites and the strongest data protection capabilities, stimulating the development potential of short-range wireless connectivity in consumer electronics, computer peripherals, home appliances, industrial automation and health care products to realize more ...
IDT Corporation announced the launch of a high-speed multiplexer
2015-03
Connectors
IDT, Integrated Device Technology
[Mär 5 2015] IDT Corporation announced the launch of a high-speed multiplexer that expands IDT's existing DDR4 portfolio for the emerging NVDIMM (non-volatile dual-in-line storage module) ecosystem. In addition, Micron Technology has selected IDT as its preferred supplier of NVDIMM multiplexers for the enterprise and cloud server markets. NVDIMM is a new architecture that provides DRAM (dynamic random access ...
Broadcom announced the launch of the industry's first fully integrated chip for virtual client devices
2015-03
Connectors
Broadcom
[Mär 4 2015] Broadcom has introduced the industry's first fully integrated system-on-chip (SoC) for virtual client devices (VCpes). Broadcom's latest SOCs are designed to give operators the flexibility to add new services in an ever-changing and multi-vendor competitive environment. Broadcom will be showcasing its leading technology at the Mobile World Congress in Barcelona, Spain, March 2-5 to advance the mo ...
Vishay's new 20V MOSFETs significantly improve the power density and reliability of portable electronics
2015-03
Connectors
Vishay
[Mär 3 2015] Vishay introduces the new 20V n-channel TrenchFET power MOSFET-SIA466EDJ in an ultra-small, thermally enhanced PowerPAK SC-70 package. With a occupying area of 2mm x 2mm, the Vishay Siliconix SiA466EDJ features the industry's highest package limiting current, enabling higher power density and reliability in portable electronics. It is also the only device in the industry with a ±20V rated VGS off ...
ST and YOGITECH jointly launch the STM32 microcontroller Safety Design component
2015-03
Connectors
STMicroelectronics
[Mär 2 2015] ST and YOGITECH, the world's leading provider of functional safety solutions, have successfully developed a software design support component with excellent flexibility to help simplify the development and certification process for safety-critical systems based on STM32 microcontrollers. The collaboration began in November 2013 and has resulted in the development of a STM32 application design saf ...
Diodes eight-pin micro logic device for extended battery life
2015-03
Connectors
Diodes Incorporated
[Mär 1 2015] Diodes Incorporated has added a 74AUP2G two-gate logic device in an eight-pin DFN1210 lead-free micropackage to its advanced family of ultra-low-power CMOS logic devices. The new products extend the battery life of the next generation of ultra-thin portable products such as smartphones and tablets by supporting low voltage and low power system designs. These devices are supplied in a voltage rang ...
Vishay introduces the industry's first new ultra-thin dual-chip inductor that operates at 155 ° C
2015-02
Passive Components
Vishay
[Feb 28 2015] Vishay announces the first device in its IHLD family of ultra-thin, high-current dual-chip inductors, the iHRD-4032KB-5A. The automotive Electronics standard certified device combines two inductors in a 4032 package and is the industry's first dual-chip inductor capable of operating at +155 ° C. Vishay Dale inductors are suitable for automotive and commercial Class D amplifier circuits, where the ...
Broadcom launches smartwatch platform that extends battery life of Android Wear devices
2015-02
Connectors
Broadcom
[Feb 27 2015] Broadcom has introduced a new smartwatch platform that dramatically reduces the power consumption of Android Wear devices. The platform will offer more features to original equipment manufacturers (Oems), including GPS and wireless charging support for sensor hub processing. Compared to the previous generation of products, Broadcom's new smartwatch platform will significantly reduce power consump ...
Intersil introduces new four-channel video decoder
2015-02
Connectors
Renesas Electronics America
[Feb 26 2015] Intersil introduces TW9984 quad-channel analog video decoder for automotive circumnavigation parking assistance applications with built-in analog video encoder to help improve driver and pedestrian safety. Based on market-leading Intersil video decoder technology, the TW9984 replaces up to nine discrete components with a single chip. At the same time, it provides the best analog decoding performa ...
Infineon promotes the next generation of cellular M2M communications
2015-02
Power
Infineon Technologies
[Feb 25 2015] Infineon Technologies, a leading provider of hardware security products for cellular M2M communications, announced the new SLM 97 and SLI 97 security controller families. The new product features unique capabilities to meet the M2M communication needs of industrial and automotive applications, such as emergency calling (eCall) and vehicle-to-vehicle (V2V) communication. The European Telecommunica ...
Broadcom introduces the industry's first 5Gbps system-level chip for microwave backpass
2015-02
Semiconductors
Broadcom
[Feb 24 2015] Broadcom announced the launch of two new system-level (SoC) chips that will provide mobile access operators with industry-leading spectrum capacity and efficiency to advance existing microwave backhaul infrastructure. For the first time, the two new SOCs achieve transmission speeds of 5G per second (Gbps), while also increasing spectral efficiency by a factor of 4 to 48 BPH /Hz. Broadcom's two ne ...