Technology Articles

2017-08 Semiconductors NXP

[Aug 29 2017] NXP Semiconductor announced the launch of its smallest 8-bit S08 microcontroller (MCU) - the MC9S08PA4AVDC microcontroller. With a new package and a size of only 3 x 3 x 0.9 mm, this product can help overcome the technical challenges of shrinking PCB space for future technologies without increasing BOM costs. The MC9S08PA4AVDC can be used in a variety of size-constrained applications that require ...

2017-08 Power United Chemi-Con

[Aug 28 2017] U-blox, a global leader in wireless and positioning modules and chips, announced that its SARA-N2 series NB-IoT (LTE Cat NB1) modules have been adopted by Flashnet in Romania. Launched the world's first narrowband IoT(NB-IoT) connected intelligent street light control system - inteliLIGHT. The pilot scheme has been deployed on the network of the OTE Group, Greece's leading telecommunications oper ...

2017-08 Semiconductors Lattice Semiconductor Corporation

[Aug 27 2017] Lattice Semiconductor, a leading provider of customized intelligent interconnect solutions to the market, announced the launch of seven new modular IP cores that support the award-winning CrossLink FPGA product family, providing increased design flexibility for consumer electronics, industrial and automotive applications. These modular IP cores provide customers with the building blocks needed to ...

2017-08 Semiconductors NXP

[Aug 26 2017] NXP Semiconductor announced that it will work with GAC Group to jointly develop a new generation of vehicle gateway platform based on Ethernet and security, thus promoting the landing of the Ethernet gateway project independently developed by the first domestic vehicle manufacturing enterprise. NXP will provide a reference design and complete gateway solution for the development of the platform, ...

2017-08 Power Teledyne LeCroy

[Aug 25 2017] Global iot enabler Telit announces the LM940. The global router and gateway industry's first Full PCI Express mini-card (mPCIe) module, which supports LTE Advanced Cat 11 at speeds up to 600 Mbps, will be licensed by mobile network operators in the fourth quarter of 2017. The industrial-class LM940 is the industry's only mPCIe card with built-in Snapdragon X12 LTE modem and Cat 11 support, provid ...

2017-08 Power Vicor

[Aug 24 2017] Vicor Corporation announced the introduction of modular current multipliers for high-performance, high-current CPU/GPU/ASIC(" XPU ") processor closures. The Vicor sealable power solution not only reduces the number of pins in the XPU socket, but also reduces the loss associated with pulling power from the motherboard to the XPU, thereby increasing the current supply and achieving maximum XPU perf ...

2017-08 Passive Components Littelfuse

[Aug 23 2017] Littelfuse, Inc., a global leader in circuit protection, introduced the 80A discrete bidirectional transient suppression diode, the latest in the SP11xx family of bidirectional transient suppression diodes (SPA diodes). The SP1103C Series 80A discrete bi-directional transient suppression diode provides circuit designers with a lower off-state voltage for protecting low-voltage power supply buses ...

2017-08 Semiconductors US-Lasers Inc.

[Aug 22 2017] UltraSoC, a leading developer of embedded analytics technology, has announced the full availability of a suite of debugging and monitoring intellectual property (IP) products for ARM's recently released AMBA 5 Coherent Hub Interface (CHI) Issue B specification. CHI Issue B is ARM's most advanced bus specification that supports complex system-on-chip (SoC) designs, and UltraSoC's monitoring and de ...

2017-08 Semiconductors Toshiba Semiconductor and Storage

[Aug 21 2017] Toshiba Memory Corporation today announced the launch of the BG3 series, a new lineup of single-package NVM Express (NVMe) customer-grade SSDS. It integrates Toshiba Memory Corporation's advanced 64-layer 3-bit-per-cell TLC(1 memory storage unit can hold 3 bits of data)BiCS FLASH™ memory and controller in a ball grid array (BGA) package. The new BG3 SSD family uses PCI EXPRESS(PCIe)Gen3 x 2 chann ...

2017-08 Semiconductors Echelon Corporation

[Aug 20 2017] German company ELMOS recently announced the launch of a new generation of ultrasonic chips E524.08 and E524.09 for automotive ultrasonic parking assistance systems. In addition to the automotive industry, the chips can also be used in industrial applications such as industrial robots, liquid level measurement, and distance measurement. Both chips comply with the AECQ-100 standard. And has been ma ...

2017-08 Semiconductors Cypress Semiconductor

[Aug 19 2017] Cypress Semiconductor, a leader in wireless connectivity solutions for the Internet of Things, today announced the launch of an upgraded Internet of Things one-stop development platform that simplifies wireless connectivity integration for smart home applications. Wireless Internet Connectivity Solutions for Embedded Devices (WICED) Studio platform now adds iCloud remote access to Wi-Fi-connected ...

2017-08 Sensors Bosch Sensortec

[Aug 18 2017] Bosch Sensortec has announced the launch of a new MEMS acceleration sensor for wearables, offering high-performance and easily integrated sensors in a compact package: the BMA456 has been designed for the motion and fitness tracking capabilities of wearables. Integrated pedometer The new acceleration sensor BMA456 from Bosch Sensortec includes a wearable product-optimized pedometer integrated dir ...