Technology Articles

2017-08 Power Maxwell Technologies

[Aug 15 2017] Marvell, a leader in semiconductor solutions for storage, networking and wireless connectivity, announced the 88W8987xA, the world's first automotive IC with integrated Wi-Fi, Bluetooth, vehicle-to-vehicle and infrastructure capabilities. This highly advanced IC supports Wi-Fi, Bluetooth 5.0 and 802.11p, making it the perfect solution for in-car applications. Today's connected cars are placing un ...

2017-08 Connectors FLIR Lepton

[Aug 14 2017] Now, electronic components and printed circuit boards are running faster and faster, smaller and smaller, through the use of small parts to achieve high performance, high speed, to reach picosecond (trillionth of a second) level of accuracy has become a trend, but this also means that parts will heat, and even short circuit or damaged parts. So detecting these heat-damaged parts is a challenge fo ...

2017-08 Power Maxwell Technologies

[Aug 13 2017] Marvell, a leader in semiconductor solutions for storage, networking and connectivity, announced the industry's first safety-enabled automotive-grade Gigabit Ethernet switch that will deliver a new level of secure data transfer for the next generation of connected vehicles. There are hundreds of computing applications in the car that require a robust, reliable and secure in-vehicle network, makin ...

2017-08 Passive Components Bourns

[Aug 12 2017] Bourns, a leading global manufacturer of electronic components, today announced the expansion of its highly rated Multifuse positive temperature coefficient polymer (PPTC) returnable fuse. Bourns introduces a new series MF-PSML(size 0805), adding low-profile components to the company's existing MF-NSML(size 1206) and MF-USML(size 1210) product lines. Bourns is massively expanding its Multifuse pr ...

2017-08 Connectors Silicon Labs

[Aug 11 2017] Silicon Labs has launched the industry's most scalable, flexible and cost-effective automotive radio solution for the global automotive infotainment market. Silicon Labs' new portfolio of Global Eagle and Dual Eagle AM/FM receivers, Digital radio tuners, and Digital Falcon coprocessors It enables automakers and Tier 1 suppliers to meet the needs of all market segments, costs, performance levels a ...

2017-08 Connectors Bourns

[Aug 10 2017] Bourns, the world's leading manufacturer of electronic components, announced the launch of a new high-current, high-power transient voltage suppressors (PTVS) that provide superior overvoltage protection. Bourns' latest PTVS-M series is specifically designed for the harsh surge requirements of high power DC applications, especially exposed and harsh environment units. The Bourns PTVS-M product fa ...

2017-08 Passive Components Littelfuse

[Aug 9 2017] Littelfuse has introduced a compact surface mount polymer automotive grade electrostatic discharge suppressor that protects sensitive equipment from contact/air discharges up to 30kV. The AXGD series XTREME-GUARD ESD suppressors are designed for high frequency high-speed applications, providing high voltage ratings (up to 32VDC) and extreme ESD protection requirements. Extremely low leakage curre ...

2017-08 Passive Components Bourns

[Aug 8 2017] Bourns has announced a new addition to its award-winning Multifuse offering - the AEC-Q200 certified high Temperature polymer Positive Temperature Coefficient (PPTC) self-restoring fuse. Available in 1206 and 1210(3014 and 3024 metric) surface mount packages with operating temperatures up to 125 ° C, the minified MF-NSHT and MF-USHT series designed by Bourns are the circuit protection of choice f ...

2017-08 Passive Components KEMET

[Aug 7 2017] KEMET announced the expansion of its surface-mount high-voltage multilayer ceramic capacitor portfolio by adding the EIA 0603 housing size (1608 metric) with C0G temperature characteristics. These devices offer the smallest sizes in their class, allowing designers to continue to meet the trend toward miniaturization in their designs while still maintaining operating voltages up to 1000VDC. This a ...

2017-08 Power Power Integrations

[Aug 6 2017] Casambi Technologies OY, the world leader in high efficiency and high reliability LED driver ics, has today jointly released a new reference design (DER-612). This is a constant voltage (CV), constant current (CC) 12 W isolated flyback power supply with power factor correction for smart lighting applications. The 3.3V power supply in the design powers the Casambi CBM-001 Bluetooth® wireless modul ...

2017-08 Connectors Microchip Technology

[Aug 5 2017] Microchip Technology announced the launch of the SAM D5x and SAM E5x single-chip microcomputer (MCU) families. These new 32-bit MCU families offer a wide range of connectivity interfaces with robust performance and reliable hardware-based security features for a wide range of applications. The SAM D5/E5 microcontroller combines the performance of an ARM Cortex-M4 processor with a floating-point u ...

2017-08 Passive Components Vishay

[Aug 4 2017] Vishay Intertechnology has announced the introduction of new JEDEC MO-137 variation AB and AE compliant 16pin and 24pin versions, expanding its OSOP series of surface-mount dual inline thin film network resistors in a 25mil pin-pitch QSOP package. Vishay Dale thin film network resistors are available in isolated, shared end-PIN and custom circuitry with resistance relative tolerances of ±0.025% a ...