Technology Articles

2017-06 Connectors NXP

[Jun 27 2017] Higher efficiency, greater power density, smaller size and lower system cost: these are the main advantages of silicon carbon-based (SiC) transistors. Infineon Technologies begins mass production of EASY 1B, Infineon's first all-silicon carbide module introduced at PCIM 2016. At PCIM 2017 in Nuremberg, Infineon showcased additional module platforms and topologies for the 1200 V CoolSiC™ MOSFET pr ...

2017-06 Semiconductors NXP

[Jun 26 2017] NXP Semiconductors announced and demonstrated its new touch solution at the NXP FTF Technology Forum. The new solution combines dedicated touch software with the touch Sensitive Interface (TSI) module available on the Kinetis KE15Z MCU and comes with a complete set of tools that enable designers to easily add touch interface designs to iot applications, including home appliances, smart buildings, ...

2017-06 Connectors Microchip Technology

[Jun 25 2017] Microchip Technology announced the release of its latest MOST150 Intelligent Network Interface Controller (INIC), which, in addition to ring topology, enables automotive manufacturers and tier-1 suppliers to adopt a daisy-chain-configured "MOST" network at the coaxial physical layer. Supports full-duplex communication. With a full-duplex daisy-chain network, a single cable is sufficient to connec ...

2017-06 Sensors Allegro MicroSystems, LLC

[Jun 24 2017] Allegro MicroSystems, LLC introduces the two-wire differential speed and direction sensor IC ATS699, which combines a newly optimized Hall-effect integrated circuit with rare-earth pellets. Provides a user-friendly solution for direction detection and true zero-speed, digital gear speed sensing. The ATS699 has a small package and can be easily assembled and used in applications related to tooth s ...

2017-06 Power Microchip Technology

[Jun 23 2017] Microchip Technology announced that the latest PIC32 MCU family extends Microchip's eXtreme Low Power (XLP) technology to 32-bit products. Today's PIC32MX customers can easily achieve higher performance with lower power consumption with PIC32MX1/2 XLP, enhancing both functionality and battery life in portable applications. Existing customers using the PIC32MX1/2 XLP family can further improve the ...

2017-06 Semiconductors Toshiba Semiconductor and Storage

[Jun 22 2017] Toshiba Corporation's Storage and Electronic Component Solutions Corporation today announced the launch of two new ics, the "TC3567CFSG" and the "TC3567DFSG," which deliver industry-leading low current consumption comparable to previous products while offering enhanced security features. These new ics are the latest in Toshiba's lineup of ics that support Bluetooth Low Energy(LE) ver.4.2 communic ...

2017-06 Connectors Analog Devices

[Jun 21 2017] Analog Devices, the world's leading provider of high-performance signal processing solutions, announced the availability of A pair of highly integrated 16-channel digital-to-analog (D/A) converters, the AD5767 and AD5766. With these two devices, the size of wireline telecommunications systems can be significantly reduced without compromising performance. The 12-bit AD5767 and 16-bit AD5766 are fu ...

2017-06 Power Bourns

[Jun 20 2017] Bourns has announced that Phoenix Contact, a leading developer of components, systems and solutions for the future of applications, will use the FLAT GDT family of products launched by Bourns in 2017 for TERMITRAB Complete products. The lightweight design of the Bourns FLAT GDT, the world's thinnest surge protection device (SPD), is an important breakthrough in terms of space and energy savings, ...

2017-06 Power Maxim Integrated

[Jun 19 2017] Imagination Technologies has announced the launch of a highly scalable 64-bit MIPS multiprocessing solution that has been rigorously evaluated and validated to meet the functional safety (FuSa) requirements of ISO 26262 and IEC 61508 standards. For emerging safety-critical systems such as autonomous driving, industrial IoT and robotics, this solution is ideal for handling their compute-intensive ...

2017-06 Passive Components Littelfuse

[Jun 18 2017] Littelfuse announced the introduction of the first sealed surface-mount fuse designed specifically for the intrinsic safety of equipment intended for use in or near hazardous sites and explosive environments and certified to the UL 913 standard. Under overcurrent and short circuit conditions, the PICO 304 series surface-mount fuse body with a 1 mm seal will minimize the heat generated and contain ...

2017-06 Power Silicon Labs

[Jun 17 2017] Silicon Labs has further expanded its Wireless Gecko system-on-chip (SoC) product line with the release of a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options. Silicon Labs' new EFR32xG13 SoC provides developers with significant design flexibility and additional functionality, making it ideal for multi-protocol solutions that use a single wireless pr ...

2017-06 Connectors Maxim Integrated

[Jun 16 2017] Maxim announced the launch of the MAX20078 synchronous buck, high-brightness LED controller, the industry's only device that provides both fast response and low electromagnetic interference (EMI), ideal for external LED lighting and advanced security products. The LED controller is ideal for matrix lighting design, providing designers with a high-performance solution, easy design, and significant ...