Microchip Technology Schnittstelle - Telekommunikation
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KategorieHalbleiter / Schnittstellen-ICs / Schnittstelle - Telekommunikation
HerstellerMicrochip Technology
Datensätze 867
Seite 15/29
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Serie | Funktion | Schnittstelle | Anzahl der Schaltkreise | Spannung - Versorgung | Stromversorgung | Leistung (Watt) | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI |
476 |
|
* | - | - | - | - | - | - | - | - | - | - |
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|
|
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI |
4.698 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA |
8.802 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
JAGUAR-1, 24X1G+4X10G CARRIER ET |
7.362 |
|
Jaguar™-1 | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE PHY W/OTN-FEC |
3.420 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GE PHY W/OTN-FEC |
7.956 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME |
2.718 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
32 CHANNEL T1/E1 FRAMER |
8.514 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
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Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA |
8.604 |
|
- | Switch | - | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
|
|
|
Microchip Technology |
IC CESOP PROC 256CH 552BGA |
5.904 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK |
115 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
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Microchip Technology |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
7.704 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT |
2.160 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
2.538 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI |
4.428 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |
|
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Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE |
5.094 |
|
- | - | - | - | - | - | - | - | - | - | - |
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|
Microchip Technology |
IC CESOP PROCESSOR 552BGA |
2.358 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
ARROW M8XFE |
4.500 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON |
3.276 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
ARROW 8XFE PB FREE |
8.136 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
522 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
5.256 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TEMAP 84FDL, LF BUMP |
4.086 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |
|
|
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Microchip Technology |
IC CESOP PROC 1024CH 552BGA |
4.183 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
3.132 |
|
- | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
6.012 |
|
- | Framer | E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
ARROW 2XGE PB FREE |
4.644 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
ARROW 2XGE PB FREE |
8.406 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
ARROW 2XGE |
4.392 |
|
- | Ethernet, SONET/SDH | GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
5.706 |
|
* | - | - | - | - | - | - | - | - | - | - |