Microchip Technology Schnittstelle - Telekommunikation
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KategorieHalbleiter / Schnittstellen-ICs / Schnittstelle - Telekommunikation
HerstellerMicrochip Technology
Datensätze 867
Seite 14/29
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Serie | Funktion | Schnittstelle | Anzahl der Schaltkreise | Spannung - Versorgung | Stromversorgung | Leistung (Watt) | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP |
8.136 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
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Microchip Technology |
IC ETHERNET SWITCH 672BGA |
168 |
|
SparX™-III-26 | Ethernet Switch | Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
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Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA |
2.988 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
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Microchip Technology |
IC DGTL SWITCH QDX QUAD 160MQFP |
847 |
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- | Switch | - | 4 | 3V ~ 3.6V | 64mA | - | -40°C ~ 85°C | Surface Mount | 160-BQFP Exposed Pad | 160-MQFP (28x28) |
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Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA |
8.352 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
|
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Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
4.176 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
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Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15 |
5.562 |
|
- | SONET/SDH | Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
|
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Microchip Technology |
10GBE WAN/LAN/BACKPLANE XAUI TO |
6.120 |
|
* | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
28-PORT LAYER 2 STACKABLE MANAGE |
5.256 |
|
E-StaX-III-28 | Ethernet Switch | - | 1 | - | - | - | - | Surface Mount | 672-BBGA, FCBGA | 672-FCBGA (27x27) |
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Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP |
6.930 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
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|
Microchip Technology |
IC DGTL SWITCH 4K X 2K 256MQFP |
6.156 |
|
- | Switch | - | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 256-BQFP | 256-MQFP (28x28) |
|
|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA |
7.470 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
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Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
1.873 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
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Microchip Technology |
10GBE DUAL CHANNEL WAN/LAN XAUI |
663 |
|
- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 196-LBGA, FCBGA | 196-FCBGA (15x15) |
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Microchip Technology |
IC VOICE ECHO CANCELLER 100LQFP |
6.318 |
|
- | Echo Cancellation | LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
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Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT |
8.064 |
|
E-StaX-III-48 | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
10GBE SNGL XFI TO DUAL XAUI XCVR |
6.372 |
|
* | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
11-PORT CE SWITCH |
148 |
|
Serval™-1 | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
10GBE DUAL XFI TO XAUI XCVR W/ED |
3.744 |
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- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 196-LBGA, FCBGA | 196-FCBGA (15x15) |
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Microchip Technology |
IC DGTL SWITCH F8KDX 196BGA |
3.598 |
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- | Switch | - | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 196-BGA | 196-PBGA (15x15) |
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Microchip Technology |
33 CHANNEL T1/E1 FRAMER |
8.856 |
|
* | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
3.744 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
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Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT |
4.140 |
|
E-StaX-III-68 | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
IC DIGITAL SWITCH 16K CH 256LQFP |
2.736 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
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Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA |
8.064 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
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Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA |
2.034 |
|
- | Echo Cancellation | - | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
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Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA |
2.016 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
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Microchip Technology |
10GBE QUAD CH WAN/LAN XAUI TO XF |
8.514 |
|
- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 324-BBGA, FCBGA | 324-FCBGA (19x19) |
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Microchip Technology |
LYNX-1, 12X1G+4X10G CARRIER ETHE |
6.948 |
|
LynX™-1 | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA |
1.296 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |