Technology Articles

2015-05 Power Silicon Labs

[Mai 22 2015] Silicon Labs, a leading provider of high-performance timing solutions for Internet infrastructure, has announced the industry's most integrated clock IC for wireless infrastructure applications, including small cell and macro cell. Silicon Labs' new Si5380 clock generator is the industry's first single-chip device capable of replacing low-phase noise integer n-division clocks, voltage controlled ...

2015-05 Connectors IQD Frequency Products

[Mai 21 2015] IDT Corporation has announced a new line of clock buffers offering the best jitter performance in its class in a compact package. The 5PB11xx series LVCMOS fan out buffers have extremely low jitter, with root-mean-square additional phase jitter (12kHz to 20MHz) of less than 50fs. It provides system designers with greater buffeting tolerance than competing products to help them meet the requiremen ...

2015-05 Semiconductors Dialog Semiconductor GmbH

[Mai 21 2015] Dialog Semiconductor Corporation introduces the world's first smart-Bluetooth (v4.2) Chip, the DA14680, designed specifically for Wearable electronic devices. This ultra-low-power chip packs all the features associated with fully managed wearable electronics into one ultra-small size, including flash memory that provides almost unlimited execution space, dedicated circuits for sensor control, ana ...

2015-05 Connectors Silicon Labs

[Mai 20 2015] Silicon Labs has announced a new family of high-speed, multi-channel digital isolators designed to provide a complete, highly integrated solution for signal and power isolation. Silicon Labs' new Si88xx isolator integrates a 78% efficient dc-dc converter and delivers up to 2W of power output, very low electromagnetic interference (EMI) and high noise suppression. The Si88xx series reduces system ...

2015-05 Power Microchip Technology

[Mai 20 2015] Micron Technology and Intel Corporation have jointly developed the world's densest 3D NAND flash memory technology. Flash memory is the storage technology used in the lightest laptops, the fastest data centers, and almost all phones, tablets, and mobile devices. This latest 3D NAND technology, developed by Intel and Micron, vertically stacks multiple layers of data storage units with remarkable p ...

2015-05 Power Microchip Technology

[Mai 19 2015] Microchip announced that MOST Cooperation has released the latest MOST150 technology coaxial physical layer specification. With the release of the new industry standard specification, Microchip can connect the smart antenna module to the vehicle's MOST150 Advanced Driver Assistance System (ADAS) and infotainment network through an OS81118AF Intelligent Network Interface Controller (INIC) equipped ...

2015-05 Semiconductors Vishay

[Mai 19 2015] Vishay Intertechnology announced the release of the new 8mm x 8mm x 1.8mm PowerPAK 8x8L in 40V TrenchFET power MOSFET-SQJQ402E, The goal is to provide alternatives to common D2PAK and DPAK packages for automotive applications that achieve high current and save space and power. The 40V TrenchFET power MOSFETs are the industry's first 8mm x 8mm placeholder, AEC-Q101-certified MOSFETs in an 8mm x 8m ...

2015-05 Semiconductors Silicon Labs

[Mai 18 2015] Silicon Labs, a leading provider of microcontrollers, wireless connectivity, analog and sensor solutions for the Internet of Things (IoT), has announced the launch of a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices. The new CP2614 interface IC provides a complete turnkey audio bridge solution for a wide range of MFi (Made for iPod ...

2015-05 Power Infineon Technologies

[Mai 18 2015] Infineon Technologies AG has introduced the OptiMOS™ 5 25V and 30V product families, a new generation of power MOSFETs in standard discrete packages. At the same time, Infineon also released a new Power module called Power Block and an integrated power module DrMOS 5x5. Together with drives and digital controllers, Infineon offers complete system solutions for servers, computers, data communicati ...

2015-05 Passive Components Vishay

[Mai 17 2015] Vishay has announced a new bi-symmetric (BiSy) single-wire ESD protection diode, the VBUS05B1-SD0, in an ultra-small CLP0603 package for portable electronics. Measuring just 0.6mm x 0.3mm and as low as 0.27mm in height, Vishay Semiconductors VBUS05B1-SD0 features ultra-low capacitance and leakage current to protect high-speed data lines and antennas from transient voltage signals. The VBUS05B1-SD ...

2015-05 Connectors Texas Instruments

[Mai 17 2015] TI has announced the launch of its industry's lowest-power 32-bit ARM Cortex-M4F MCU, the MSP432TM microcontroller (MCU) platform. These new 48MHz MCUS leverage TI's expertise in ultra-low power MCUS to optimize performance while avoiding power loss, with effective and standby power consumption of only 95µA/MHz and 850nA, respectively. Industry-leading integrated simulators such as high-speed 14- ...

2015-05 Power Broadcom

[Mai 16 2015] Broadcom announced the launch of a new HD set-top box System-on-a-chip (HD STB SoC) for the China Free (FTA) satellite market. With the rapid growth in the promotion of high-definition programming in China, Broadcom's BCM7228 chip can support satellite TV operators to promote more advanced services and improve high-definition satellite broadcast transmission capabilities by integrating broadcast ...