Technology Articles

2017-07 Sensors OmniVision Technologies Inc

[Jul 1 2017] OmniVision Technologies, an industry-leading developer of digital image solutions, has announced the OV16B10, a high-performance, low-power and high-resolution image sensor designed for the next generation of flagship smartphones. Based on OmniVision's second generation 1.12 micron PureCel Plus-S technology, the OV16B10 sensor features high full well capacity, highly sensitive imaging, and phase ...

2017-07 Sensors OmniVision Technologies Inc

[Jul 1 2017] OmniVision Technologies, an industry-leading developer of digital imaging solutions, announced the introduction of the OV13A10 and OV13A1Q, the new members of the 13-megapixel PureCel Plus-S laminated chip sensor family. Based on OmniVision's second generation PureCel Plus-S 1.0 micron pixel technology, the latest sensors capture excellent images and provide advanced features such as high-resolut ...

2017-06 Passive Components Analog Devices

[Jun 30 2017] Linear Technology Corporation, a division of Analog Devices, introduces the LTC3636 and LTC3636-1 high-efficiency, 4MHz synchronous dual-output step-down regulators. Both devices feature a unique constant frequency/controlled on-time, current mode control scheme with phase-locked switching frequencies. In addition, its innovative design architecture reduces conducted and radiative emissions. Thes ...

2017-06 Passive Components Infineon Technologies

[Jun 29 2017] Infineon Technologies AG has further expanded its 1200 V single tube IGBT portfolio with A new product range of up to 75 A. The TO-247 Plus package also incorporates a full constant current anti-parallel diode. The new TO-247 Plus 3-pin and 4-pin packages meet the growing demand for higher power density and greater efficiency. Typical applications that require a high power density of 1200VIGBT in ...

2017-06 Passive Components Infineon Technologies

[Jun 28 2017] Infineon Technologies AG introduces a new packaging technology, TRENCHSTOP Advanced Isolation. TRENCHSTOP Advanced Isolation can be used with TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs to ensure best-in-class thermal performance and simplify manufacturing processes. Both versions are optimized for performance to replace full plastic encapsulation (FullPAK) and standard and high-performance insul ...

2017-06 Connectors NXP

[Jun 27 2017] Higher efficiency, greater power density, smaller size and lower system cost: these are the main advantages of silicon carbon-based (SiC) transistors. Infineon Technologies begins mass production of EASY 1B, Infineon's first all-silicon carbide module introduced at PCIM 2016. At PCIM 2017 in Nuremberg, Infineon showcased additional module platforms and topologies for the 1200 V CoolSiC™ MOSFET pr ...

2017-06 Semiconductors NXP

[Jun 26 2017] NXP Semiconductors announced and demonstrated its new touch solution at the NXP FTF Technology Forum. The new solution combines dedicated touch software with the touch Sensitive Interface (TSI) module available on the Kinetis KE15Z MCU and comes with a complete set of tools that enable designers to easily add touch interface designs to iot applications, including home appliances, smart buildings, ...

2017-06 Connectors Microchip Technology

[Jun 25 2017] Microchip Technology announced the release of its latest MOST150 Intelligent Network Interface Controller (INIC), which, in addition to ring topology, enables automotive manufacturers and tier-1 suppliers to adopt a daisy-chain-configured "MOST" network at the coaxial physical layer. Supports full-duplex communication. With a full-duplex daisy-chain network, a single cable is sufficient to connec ...

2017-06 Sensors Allegro MicroSystems, LLC

[Jun 24 2017] Allegro MicroSystems, LLC introduces the two-wire differential speed and direction sensor IC ATS699, which combines a newly optimized Hall-effect integrated circuit with rare-earth pellets. Provides a user-friendly solution for direction detection and true zero-speed, digital gear speed sensing. The ATS699 has a small package and can be easily assembled and used in applications related to tooth s ...

2017-06 Power Microchip Technology

[Jun 23 2017] Microchip Technology announced that the latest PIC32 MCU family extends Microchip's eXtreme Low Power (XLP) technology to 32-bit products. Today's PIC32MX customers can easily achieve higher performance with lower power consumption with PIC32MX1/2 XLP, enhancing both functionality and battery life in portable applications. Existing customers using the PIC32MX1/2 XLP family can further improve the ...

2017-06 Semiconductors Toshiba Semiconductor and Storage

[Jun 22 2017] Toshiba Corporation's Storage and Electronic Component Solutions Corporation today announced the launch of two new ics, the "TC3567CFSG" and the "TC3567DFSG," which deliver industry-leading low current consumption comparable to previous products while offering enhanced security features. These new ics are the latest in Toshiba's lineup of ics that support Bluetooth Low Energy(LE) ver.4.2 communic ...

2017-06 Connectors Analog Devices

[Jun 21 2017] Analog Devices, the world's leading provider of high-performance signal processing solutions, announced the availability of A pair of highly integrated 16-channel digital-to-analog (D/A) converters, the AD5767 and AD5766. With these two devices, the size of wireline telecommunications systems can be significantly reduced without compromising performance. The 12-bit AD5767 and 16-bit AD5766 are fu ...