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ON Semiconductor introduces the first highly scalable next-generation automotive image sensor family
2017-10
Sensors
ON Semiconductor
[Okt 28 2017] ON Semiconductor introduces a new CMOS image sensor platform that takes performance and image quality to the next level for automotive applications such as ADAS, mirror replacement, rear and circumnavigation systems, and autonomous driving. The HayabusaTM platform features a breakthrough 3.0 micron backlighting pixel design. It offers the industry's highest 100,000 electron charge capacity and ot ...
ST launches waterproof pressure sensor with first order from Samsung Wearables.
2017-10
Sensors
STMicroelectronics
[Okt 27 2017] STMicroelectronics' latest miniature pressure sensors take underwater measurement accuracy to a new level. The new sensor was unveiled by Samsung in its latest smart band, the Samsung Gear Fit 2 Pro. As smartwatches and wearable fitness trackers become integrated into every aspect of life, households want to further expand the use of the devices to record performance in more sports, such as swimm ...
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STMicroelectronics announces Platform Security architecture to enhance the protection of connected smart devices.
2017-10
Connectors
STMicroelectronics
[Okt 26 2017] STMicroelectronics, a leading global supplier of semiconductors across multiple electronic applications and the world's leading vendor of Arm microcontrollers for Internet of Things (IoT) devices, has announced a Platform Security Architecture (PSA). PSA is a key technology for achieving best-in-class pervasive network security. The STM32H7 high-performance microcontroller from ST uses the same s ...
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Littelfuse introduces the first D-PAK packaged SCR thyristor at 150°C junction temperature
2017-10
Passive Components
Littelfuse
[Okt 25 2017] Littelfuse announced the introduction of the first of its kind high temperature SCR (Silicon Controlled Rectifier) thyristor with junction temperatures up TO 150°C in a compact surface mount D-PAK (TO-252) package. The product is also available in a through-hole V-PAK (T0-251) package. Standard SJ series SCR thyristors have gate current trigger levels as low as 6mA (up to 15 mA) at voltages of ab ...
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TI introduces Resonant controllers with integrated high voltage gate drivers
2017-10
Connectors
Texas Instruments
[Okt 24 2017] Texas Instruments introduces a new inductor-Inductor-capacitor (LLC) resonant controller with an integrated high-voltage gate driver that delivers the industry's lowest standby power consumption and longer system life. The UCC256301 provides a cost-effective system solution that helps meet the demanding energy efficiency standards of a wide range of AC/DC applications, including digital TVS, gami ...
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STMicroelectronics announces micro unconnected modules with built-in boostedNFC technology
2017-10
Connectors
STMicroelectronics
[Okt 23 2017] STMicroelectronics introduces semiconductor technology for convenient and secure contactless transactions using the most popular fashion accessories such as wristbands, watches or jewelry. St's industry-leading ST53G system packaging solution integrates its market-leading Near Field communication (NFC) technology and secure transaction core in a single package. As consumers become more comfortabl ...
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Vishay announces WSBS battery shunt for high accuracy, low cost and vibration resistance
2017-10
Connectors
Vishay
[Okt 22 2017] Vishay Intertechnology announces the launch of the new WSBS8518 with M3 and M4 screw holes, respectively... .M3 and WSBS8518... M436W Poer Metal Strip battery shunt. With an extremely low resistance of 50μQ and an external dimension of 8518, these Vishay Dale devices offer higher accuracy and lower cost than Hall-effect galvanometers, while the screw holes assist the PCB mounting process, providi ...
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STMicroelectronics launches Open Development Platform for Secure Vehicle Connected applications
2017-10
Connectors
STMicroelectronics
[Okt 21 2017] The Modular Vehicle Information Services Platform (MTP) is an open development environment that enables developers to prototype advanced intelligent driving applications, including vehicle-to-back-office servers, on-road infrastructure connectivity, and shop-floor connectivity. The MTP platform integrates a central processing unit (CPU) module based on ST's recently launched Telemaco3P secure veh ...
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Qorvo provides wider, faster and lower cost Wi-Fi solutions for the industry
2017-10
Semiconductors
Qorvo US Inc.
[Okt 20 2017] Qorvo announced the expansion of its 802.11ax portfolio for Wi-Fi gateways, set-top boxes, routers, and enterprise access points. The high-efficiency portfolio of integrated modules and advanced filters improves Wi-Fi coverage, helps enable smaller end products, and reduces costs for consumers, service providers, and manufacturers. CeesLinks, General Manager of Qorvo's Wireless Connectivity Busin ...
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ON Semiconductor introduces preconfigured development kits to make it easier to build hearing AIDS
2017-10
Semiconductors
ON Semiconductor
[Okt 19 2017] ON Semiconductor releases Ezairo Pre Suite, continuing to expand its portfolio of ultra-low-power solutions for the health hearing industry. The development kit provides turnkey solutions based on the company's Ezairo7100 digital signal processor (DSP). The wireless-enabled Ezairo7150SL is the first hybrid module supported by the Ezairo pre-configured suite, which includes firmware packs to make ...
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STMicroelectronics Built-in Security Module Automotive processor protects Internet cars against cyber threats
2017-10
Semiconductors
STMicroelectronics
[Okt 18 2017] STMicroelectronics is leading the market for Internet vehicle information security protection with its latest automotive processors with built-in dedicated amine full modules. There are already millions of connected cars on the road, and industry analysts predict that by 2020, the total number of connected cars will exceed 250 million. Aftermarket equipment such as vehicle information service con ...
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NXP launches a new automotive processor platform to accelerate the time to market for future vehicles
2017-10
Semiconductors
NXP
[Okt 17 2017] NXP Semiconductor announced a new control and computing platform for connected, electric and autonomous vehicles. The NXP S32 platform is the world's first fully scalable automotive computing architecture, soon to be adopted by premium and general production automotive brands. The S32 platform provides the unified architecture of the microcontroller microprocessor (MCU/MPU), providing exactly the ...