Technology Articles

2017-10 Semiconductors ON Semiconductor

[Okt 3 2017] Driving energy efficient innovation, ON Semiconductor introduces a new programmable RF transceiver System-on-chip package (SiP) that integrates an advanced RF system single-chip (SOC) with all surrounding bill of materials, including a thermocooled crystal oscillator TCXO. AX-SIP-SFEU offers the most integrated Sigfox solution for both upstream (send) and downstream (receive) communications. This ...

2017-10 Passive Components Littelfuse

[Okt 3 2017] Littelfuse announced the launch of the 0.9pF +30kV distributed unidirectional Transient Suppression Diode Array (SPA@ diode) family. The SP3222 series transient suppression diode array combines a low capacitance rail to rail diode with an additional Zener diode diode to protect electronic devices from destructive electrostatic discharge (ESD). This powerful - electrode is AEC-Q101 compliant and s ...

2017-10 Semiconductors Microchip Technology

[Okt 2 2017] Microchip Technology announced the launch of PAC1934, a high-precision power and energy monitoring chip that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system. On battery-powered Windows10 devices, the measurement accuracy is up to 99%. Microchip's PAC 1934 and Windows 10 drivers, combined with Microsoft's E3 service, improved battery usage meas ...

2017-10 Sensors Vishay

[Okt 2 2017] Vishay Intertechnology has announced the release of the first ultra-thin, high-current IHLP inductor with extended frequency range, the IHLP-1616BZ-0H. The new IHLP 1616BZ-0H series has a high frequency performance of 10 MHZ, with the lowest loss of inductors currently on the market at 1MHz and above. By using the IHLP-1616BZ-0H, design engineers can improve efficiency and potentially reduce the ...

2017-10 Semiconductors NXP

[Okt 1 2017] HELL A Aglaia and NXP are expanding the current ADAS vehicle vision platform with the addition of artificial intelligence (AI) expected in 2018. HELL AAglaia's ADAS platform, powered by NXP's S32 and i.MX automotive-grade processors, enables secure, scalable and comprehensive NCAP forward-looking capabilities, enabling 0EM to deploy the ADAS platform into production vehicles. The next step in the ...

2017-10 Semiconductors NXP

[Okt 1 2017] NXP Semiconductor, the world's largest supplier of automotive semiconductor solutions, has expanded its leadership in secure vehicle-to-many (V2X) communications with the release of its next-generation RoadLINKTM solution. The new NXP SAF5400 is the world The first automotive standard compliant high-performance single-chip DSRC modem features a unique scalable architecture, industry-leading new s ...

2017-09 Passive Components Harwin Inc.

[Sep 15 2017] Harwin continues to strengthen its portfolio of interconnect solutions for harsh application environments by adding new products to its flagship Datamate Hi-Rel product family. In response to space-constrained RF/wireless designs, each member of the Datamate Coax family includes multiple (linked) coaxial contacts in a compact housing. Because they provide access to multiple coaxial lines through ...

2017-09 Power Maxim Integrated

[Sep 14 2017] Maxim Integrated's MAX30004 Biopotential Analog Front End (AFE) is a single-channel biopotential heart rate monitoring AFE solution for wearable medical applications, which can be used in products such as heart rate chest straps and single-lead wireless heart rate patch, during intense exercise. There is no need to extract and process electrocardiogram (ECG) data in the microcontroller. The Maxim ...

2017-09 Connectors Renesas Electronics America

[Sep 14 2017] Intersil announced the launch of two new high-speed isolated RS-485 differential bus transceivers, ISL32741E and ISL32740E, that provide 40Mbps two-way data communication for Industrial Internet of Things (IIoT) networks. The ISL32741E offers 1,000 VRMS operating voltage and 6kV enhanced isolation, more than 2 times higher than competing solutions, and meets the higher operating voltage and enhan ...

2017-09 Passive Components Vishay

[Sep 13 2017] Vishay Intertechnology has announced the introduction of the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications, the VitramonVJ HIFREQ HT series, with an operating temperature range of +200 C. For communications base stations and defense communications systems, Vishay's VitramonVJ HIFREQ HT series offers four compact sizes, al ...

2017-09 Power Infineon Technologies

[Sep 13 2017] Infineon Technologies AG will enter the packaged silicon microphone market to meet the demand for high-performance, low-noise MEMS microphones. The analog and digital microphones are based on Infineon's dual-backplane MEMS technology, and the 70 dB signal-to-noise ratio (SNR) makes it stand out. The microphone also has very low distortion at 135 dB sound pressure level (SPL) - 10%. Available in a ...

2017-09 Semiconductors Allegro MicroSystems, LLC

[Sep 13 2017] Allegro MicroSystems announced the launch of two new N-channel power MOSFET driver ics capable of controlling MOSFETs connected in half-bridge configurations. Allegro's A4926 and A4927 are designed for automotive applications with high power inductive loads and are suitable for DC pumps (braking, oil, water and fuel), air conditioning systems (HVAC), solenoids and actuators. These devices are par ...