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Schnittstelle - Spezialisiert

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KategorieHalbleiter / Schnittstellen-ICs / Schnittstelle - Spezialisiert
Datensätze 3.987
Seite 61/133
Bild
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Beschreibung
Auf Lager
Menge
Serie
Anwendungen
Schnittstelle
Spannung - Versorgung
Paket / Fall
Lieferantengerätepaket
Montagetyp
ZSSC3131BA2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
7.704
*
-
-
-
-
-
-
MCZ33903DP3EKR2
NXP
SYSTEM BASIS CHIP 2X 3.3 V/400M
2.502
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33903DP5EKR2
NXP
SYSTEM BASIS CHIP 2X 5.0 V/400M
2.700
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
ZSC31015EAG1-R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
5.040
RBicLite™
Sensor Signal Conditioner - Resistive
ZACwire™ One-Wire Interface
2.7V ~ 30V
8-SOIC (0.154", 3.90mm Width)
8-SOIC
Surface Mount
ZSSC3135BA2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
4.824
*
-
-
-
-
-
-
ZSSC3015NA2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
3.672
*
-
-
-
-
-
-
ZSSC4165BE2W
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
2.034
Automotive, AEC-Q100
Sensor Signal Conditioner - Resistive
I²C, SENT, ZACwire™
4.75V ~ 5.25V
24-VFQFN Exposed Pad
24-QFN (4x4)
Surface Mount
ZSSC4175BE2W
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
4.374
Automotive, AEC-Q100
Sensor Signal Conditioner - Resistive
I²C, SENT, ZACwire™
4.75V ~ 5.25V
24-VFQFN Exposed Pad
24-QFN (4x4)
Surface Mount
MCZ33904D3EKR2
NXP
SYSTEM BASIS CHIP 2X 3.3 V/400M
6.282
-
System Basis Chip
CAN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33904D5EKR2
NXP
SYSTEM BASIS CHIP 2X 5.0 V/400M
6.516
-
System Basis Chip
CAN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33903D3EKR2
NXP
SYSTEM BASIS CHIP 2X 3.3 V/400M
5.292
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33903D5EKR2
NXP
SYSTEM BASIS CHIP 2X 5.0 V/400M
8.370
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MC33742PEPR2
NXP
IC SYSTEM BASE W/CAN 48QFN
2.250
-
Automotive
SPI Serial
5.5V ~ 18V
48-VFQFN Exposed Pad
48-QFN-EP (7x7)
Surface Mount
ZSSC4151AE2V
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
3.474
*
-
-
-
-
-
-
ZSSC3131BE2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
4.176
*
-
-
-
-
-
-
ZSSC3135BE2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
5.040
*
-
-
-
-
-
-
ZSSC3136BA2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
6.696
Automotive, AEC-Q100
Sensor Signal Conditioner - Resistive
I²C, ZACwire™ One-Wire Interface
4.5V ~ 5.5V
14-SSOP (0.209", 5.30mm Width)
14-SSOP
Surface Mount
MCZ33903DS3EKR2
NXP
SYSTEM BASIS CHIP LIN 2X 3.3 V
3.780
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33903DS5EKR2
NXP
SYSTEM BASIS CHIPLIN 2X 5.0 V/
8.964
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
ZSSC3138BA2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
5.634
*
-
-
-
-
-
-
ZSSC5101BE4R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
3.672
*
-
-
-
-
-
-
ZSSC3224BI3R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
7.560
*
-
-
-
-
-
-
ZSSC3136BE2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
3.600
Automotive, AEC-Q100
Sensor Signal Conditioner - Resistive
I²C, ZACwire™ One-Wire Interface
4.5V ~ 5.5V
14-SSOP (0.209", 5.30mm Width)
14-SSOP
Surface Mount
ZSSC3015NE2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
6.408
*
-
-
-
-
-
-
ZSSC3138BE2R
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
3.114
*
-
-
-
-
-
-
MCZ33905DS3EKR2
NXP
SYSTEM BASIS CHIP LIN 2X 3.3 V
4.032
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
MCZ33905DS5EKR2
NXP
SYSTEM BASIS CHIP LIN 2X 5.0 V
2.934
-
System Basis Chip
CAN, LIN
5.5V ~ 28V
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount
ZSSC3122AA2T
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
6.354
*
-
-
-
-
-
-
ZSSC3123AA2T
IDT, Integrated Device Technology
SENSOR SIGNAL CONDITIONER
2.016
*
-
-
-
-
-
-
MC33975TEKR2
NXP
IC SWITCH DETECT MULT 32-SOIC
2.916
-
Switch Monitoring
SPI Serial
-
32-SSOP (0.295", 7.50mm Width) Exposed Pad
32-SOIC-EP
Surface Mount