NXP PMIC - Power Management - Spezialisiert
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KategorieHalbleiter / Energieverwaltungs-ICs / PMIC - Power Management - Spezialisiert
HerstellerNXP USA Inc.
Datensätze 595
Seite 9/20
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Anwendungen | Stromversorgung | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
4.914 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
IC SYSTEM BASIS CHIP 32LQFP |
2.610 |
|
- | System Basis Chip | 4.5mA | 5.5V ~ 27V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
5.958 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
2.358 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
8.190 |
|
- | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
3.598 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
2.790 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
8.190 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS |
7.758 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
7.668 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
5.256 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
PF1550 |
7.632 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
IC REG MULTIPLE VOLTAGE 20HSOP |
2.898 |
|
- | Ignition Buffer, Regulator | 110µA | 9.5V ~ 18V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |
|
|
|
NXP |
IC CTRL SMALL ENG 2CYL 48LQFP |
3.510 |
|
- | Small Engine | 10mA | 4.5V ~ 36V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V |
2.610 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC REG MULTIPLE VOLTAGE 20HSOP |
4.518 |
|
- | Ignition Buffer, Regulator | 110µA | 9.5V ~ 18V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
6.552 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
5.652 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
7.488 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
3.870 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
TRANSFORMER PHYSICAL LAYER |
3.449 |
|
- | Isolated Communications Interface | 40mA | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
|
NXP |
DSC 64 LQFP 64K FLASH |
2.952 |
|
- | Wireless Charging | - | - | - | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V |
5.418 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8.406 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC REG 9OUT BUCK/LDO 48QFN |
2.934 |
|
- | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC REG 9OUT BUCK/LDO 48QFN |
3.924 |
|
- | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
6.228 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 48QFN |
4.824 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC I.MX7 PRE- |
4.986 |
|
- | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
7.128 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |