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U-blox launches GPS/GNSS SoC solution

Jun 6 2012 2012-06 Power United Chemi-Con
Article Cover
U-blox and GLOBALFOUNDRIES have jointly announced: The u-blox 7 Global Positioning System/Global Navigation Satellite System on Chip (GPS/GNSS SoC), based on GLOBALFOUNDRIES 'advanced 65nm low-power Enhanced (LPe) RF process technology platform, is now available.

     U-blox and GLOBALFOUNDRIES have jointly announced: The u-blox 7 Global Positioning System/Global Navigation Satellite System on Chip (GPS/GNSS SoC), based on GLOBALFOUNDRIES 'advanced 65nm low-power Enhanced (LPe) RF process technology platform, is now available.
Eric De Mey, Vice President of Integrated Circuits at u blox, said: "U-Blox is always looking for robust and reliable partners to support our aggressive product development and go-to-market plans. "GLOBALFOUNDRIES has a strong reputation for delivering exceptional customer service, and we are confident that working with them will provide the right solution for our products."

     U-blox's latest GNSS platform upgrade has successfully created the UBX-G7020 multi-frequency multi-mode GNSS chip, which supports all global satellite positioning standards including: GPS, GLONASS, QZSS, Compass and Galileo. Thanks to GLOBALFOUNDRIES 'advanced 65nm LPe RF process technology, the satellite receiver IC has ultra-small size, ultra-low power consumption, and integrates both RF and baseband subsystems.

     Muljadi Tantra, Senior Director of Product Marketing at GLOBALFOUNDRIES, said: "We are very pleased that u-blox has chosen GLOBALFOUNDRIES to contract its latest GPS/GNSS chips. "Our 65nm LPe RF process technology is an approved platform for low power and high performance SoC solutions in highly power-sensitive mobile applications such as GPS, WiFi, Bluetooth, LTE receivers, mobile TVS and digital receivers."

     In 2009, GLOBALFOUNDRIES launched the 65nm LPe RF process solution, which provides advanced process technology, Covers RF components, low leakage current transistors, VNCaps (metal-oxide-metal capacitors), MIMs (metal-insulator-metal capacitors), thick metal film inductors and varactors. The process solution is now supported by an accurate model that addresses both performance and functionality, while the 65nm LPe RF physics design suite has added a large number of scalable parametric units, inductive synthesizers, and more.

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