The new EMIPAK 1B encapsulates diode and MOSFET power modules

     Vishay Intertechnology announced the launch of seven new diode and MOSFET power modules specifically for in-car charging applications. The integrated solution with a variety of circuit configurations uses PressFit's patented pin press technology to combine efficient fast body diode MOSFET and SiC, FRED Pt and MOAT diode technologies in a small EMIPAK 1B package.

     The device features a variety of circuit configurations required for AC/DC, DC/DC, and DC/AC conversions for on-board charging applications, including input/output Bridges, full-bridge inverters, and power factor correction (PFCS) for a variety of power ratings. Modules comply with AQG-324 automotive standards and provide complete solutions for electric (EV) and hybrid (HEV) vehicles as well as electric bicycles, agricultural machinery, railway rolling stock, etc.

     Device EMIPAK packaging uses a matrix approach with a variety of custom circuit configurations built into the same 63 mm x 34 mm x 12 mm small package. Helps increase power density compared to discrete solutions, while flexibly using each module at different power levels for industrial and renewable energy applications, such as welding, plasma cutting, UPS, solar inverters and wind turbines.

     The AI2O3 directly applied copper (DBC) substrate improves thermal performance, and the optimized layout helps reduce stray inductance and improve EMI performance. The modular PressFit pin pressing technology facilitates PCB installation and reduces mechanical stress on substrate, while the baseless construction improves reliability by reducing the need for soldering interfaces.