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The first automotive embedded MRAM using 16nm FinFET technology

Mai 27 2023 2023-05 Semiconductors NVE Corp/Sensor Products
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NXP Semiconductors is collaborating with TSMC to supply the industry's first automotive-embedded MRAM in 16nm FinFET technology. As automakers move to software-defined vehicles (SDVs), they need to support numerous generations of software upgrades on a single hardware platform. Combining the company's high-performance S32 automotive processors with fast and highly reliable next-generation non-volatile memory in 16nm FinFET technology delivers the perfect hardware platform for this transition.

     NXP Semiconductors has partnered with Taiwan Semiconductor to provide the industry's first embedded automotive MRAM using 16nm FinFET technology. As automakers move to software-defined vehicles (SDVS), they need to support multiple generations of software upgrades on a single hardware platform. Combining the company's high-performance S32 automotive processors with fast, highly reliable next-generation non-volatile memory using 16nm FinFET technology provides the perfect hardware platform for this transition.

     Compared to flash memory, which takes about a minute, MRAM can update 20MB of code in less than three seconds, minimizing downtime associated with software updates and allowing automakers to eliminate bottlenecks caused by long hours of module programming. In addition, MRAM provides highly reliable technology for vehicle task configuration by providing up to 1 million update cycles with durability 10 times higher than flash memory and other emerging storage technologies.

     SDVS allow automakers to introduce new comfort, safety and convenience features through OTA updates, extending the life of vehicles and improving their functionality, appeal and profitability. As software-based options become more common in vehicles, the frequency of updates will increase and the speed and robustness of MRAM will become more important. TSMC's 16FinFET embedded MRAM technology transcends the rigors of automotive applications with its 1 million cycle life, support for solder reflux and 20 years of data retention at 150 ° C.

     "NXP innovators have been quick to recognize the potential of TSMC's new process technologies, especially in demanding automotive applications," said Dr. Kevin Chang, senior vice president of Business development at TSMC. We are excited to see our leading MRAM technology applied to NXP's S32 platform to enable the next generation of software-defined vehicles.

     "NXP's successful partnership with Taiwan Semiconductor spans decades and has consistently delivered high quality embedded memory technology to the automotive market," said Henri Ardevol, executive vice president and general manager of automotive processing at NXP. MRAM is a breakthrough addition to NXP's S32 automotive solution portfolio, supporting next-generation vehicle architectures."

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