Semiconductor solidification process: the core technology of efficient chip packaging

At the moment of the rapid development of electronic technology, the development of the semiconductor industry is directly related to the performance and reliability of various electronic products! In this field, the semiconductor solid-state crystal process is the key technology, the role of the boss! This process is not only related to the packaging quality of the chip, but also directly affects the performance, cost and production efficiency of the final product! Next, let's take a look at the basic concepts, core processes, application prospects and challenges of this semiconductor curing process.

What is the semiconductor curing process?

The semiconductor curing process is a series of operations in which the bare mode is physically or chemically attached to the package substrate. This process is not simple, not only to consider the packaging of the chip itself, but also to integrate welding, insulation materials, heat dissipation structure and many other functions. This process must ensure that the  chip can successfully conduct current and heat while working, while also having very good mechanical strength and long-term environmental stability.

Core flow during solid crystallization

The solidification process generally includes several core processes:

1. Prepare chips

When you first start the solidification process, you have to pick up the bare chip. You have to give the chip a bath and check to make sure there are no dirty or problematic areas on the surface. The commonly used cleaning methods are ultrasonic cleaning and chemical cleaning to clean the dirt and oxide on the surface. During inspection, high-precision equipment such as an electron microscope is used to check the chip to ensure that it meets the package requirements.

2. Bonding layer

The connection between the chip and the substrate usually relies on a special adhesive. The adhesive must have good thermal conductivity and insulation, so that the chip has good thermal management and electrical performance when running. Commonly used adhesives include epoxy resin, polyurethane, etc., and the coating method is generally screen printing or dispensing to ensure that the adhesive can be evenly coated on the back of the chip and the substrate.

3. Fix and heat

Once the adhesive is applied, the chip needs to be placed exactly where it needs to be on the substrate. To bond it better, we need to heat it up. This heating causes the adhesive to harden at a specific temperature so that the chip and the substrate can adhere firmly together. The heating temperature and time must be adjusted according to the characteristics of the adhesive, and the curing process must be smooth.

4. Welding and connection

With the chip in place, it's time to weld. This is usually done by using metal balls or wires to create an electrical connection between the chip's electrodes and the substrate. The quality of welding is directly related to the integrity and stability of signal transmission, so the choice of welding method and the control of parameters are very important. Common welding processes are thermoacoustic welding and laser welding.

5. Bag forming

After welding, the chip and its surrounding structure must be packaged and molded to avoid environmental pollution or physical damage. It is mainly packaged in plastic or ceramic materials. In this step, the choice of material directly affects the thermal performance and durability of the chip, so it must be carefully considered.

6. Testing and screening

After the curing process is complete, the encapsulated chip must undergo rigorous testing and screening. The test items include electrical performance test, temperature test and mechanical strength test. Only the chips that pass all the tests move on to the next production process. This can effectively reduce the defective rate and improve the overall quality of the product.

Application field of solid crystallization process

Semiconductor solidification process is used in many industries, such as consumer electronics, communication technology, automotive electronics, industrial control and many other fields have its figure. In consumer electronics, Solidus technology can enhance the performance of devices such as mobile phones and tablets, allowing them to have higher computing power and faster reaction times. In the field of communication technology, the solid crystal process is also one of the key technologies of 5G base stations and high-speed data transmission equipment, which provides old support for the construction of modern communication networks.

The development trend of solid crystal technology

As technology continues to advance, the solidification process is constantly changing. To improve integration and performance, new packaging technologies such as 3D packaging and System in Package (SiP) are slowly emerging. In addition, the miniaturization trend is driving solid technology toward smaller sizes and higher densities. This not only requires a new material system and process flow, but also puts forward higher requirements for machining accuracy and tolerance control.

The challenges we face

Although the solid crystal process is an important role in the semiconductor industry chain, it also faces many challenges. First, as the demand for chip packaging develops in the direction of higher frequencies and high power, the requirements for thermal management are becoming more stringent. Secondly, the development and application of new materials must solve the contradiction between environmental protection and economy. In addition, in the process of large-scale production, quality control and the improvement of yield are also problems that the industry needs to break through.

As the core technology of efficient chip packaging, semiconductor solidification technology is in a rapid development stage. As market demand continues to rise, the optimization and innovation of process technology will certainly have a profound impact on the entire semiconductor industry