STMicroelectronics announces New Toolchain and Software Package to simplify edge computing development with intelligent inertial Sensors

     STMicroelectronics has released an Intelligent Sensor Processor programming Toolchain and accompanying software package to facilitate developers to write application code for the latest generation of intelligent MEMS IMU sensor modules ISM330IS and LSM6DSO16IS. The intelligent sensor processor (ISPU) inside the module is used to handle the operational work related to motion detection, for example, running the activity recognition and anomaly detection algorithms directly on the sensor. Moving the algorithm down to the edge of the network helps to reduce the system power consumption, shorten the response delay, reduce the amount of computation of the local microcontroller, and set the behavior of the sensor according to the specific application.

     When using the ISPU toolchain, developers can write smart sensor software in the familiar and widely used C programming language, choosing to code in a command line interface (CLI) or in an Eclipse-based development environment such as STM32CubeIDE. AlgoBuilder, Unicleo and other graphical user interfaces can also be selected.

     The X-CUBE-ISPU package contains templates and sample projects, as well as an off-the-shelf software library to help developers quickly learn how to use ISPU, write ISPU code, and can modify the package to develop custom algorithms. The package also provides pre-created files that allow users to load X-CUBE-ISPU samples directly into the sensor using a GUI graphical user interface without writing code. In addition, there are more examples, tutorials, and other development resources in the stmicroelectronics GitHub repository.

     Using these resources can help reduce development times for applications such as personal electronics, including wearables for activity recognition and health monitoring, as well as industrial equipment such as asset traceability, device health monitors, robots and machine controllers.

     STMicroelectronics' ISM330IS and LSM6DSO16IS inertia modules contain alway operating 3D accelerometers and 3D gyroscopes, as well as embedded ISPU processors. The power consumption of both modules is very low, only 0.46mA in low power mode and 70μg/√Hz in high performance mode. The sensor data fusion function allows the module to connect to four external sensors to collect data. An embedded temperature sensor is also included in the module. Both products come in compact grille array (LGA) plastic packages of 2.5mm x 3mm x 0.83mm.

     SPM Instrument, a working condition monitoring and process optimization innovator based in Strangnas, Sweden, has developed a vibration degree analysis product using ISM330IS sensors and quickly customised ISPU behaviour using the stmicroelectronics ISPU toolchain and X-CUBE-ISPU development environment.

     SPM's sensing solutions are ideal for remote monitoring of standard manufacturing equipment such as pumps and fans, as well as machines and equipment placed in harsh or hazardous environments that are difficult for maintenance personnel to access. The ISM330IS allows designers to meet tight power budgets while also overcoming the problem of poor computing power in local microcontrollers.