ROHM developed a small, efficient MOSFET

     In recent years, with the development of small equipment towards high performance and multi-function, the power required inside the equipment also shows an increasing trend. The increase of battery size leads to less and less space for installation of components. In addition, there is a limit to the size of the battery. In order to make more efficient use of the limited battery power, it is necessary to reduce the power loss of electrical components. Therefore, ROHM has developed a small and efficient 20V Nch MOSFET "RA1C030LD" that is ideal for switching applications on wearable devices, listening devices such as wireless headphones, and thin and small devices such as smartphones.

     In response to this demand, the development of easy to miniaturize and excellent characteristics of wafer-level chip size package MOSFET has gradually become the mainstream of the industry. Taking advantage of being an IC manufacturer itself, ROHM has developed smaller power MosFeTs with lower power losses by flexibly applying its IC process to significantly reduce the wiring resistance that would have been added in previous discrete device processes.

     The new product incorporates ROHM's own IC process in a wafer-scale chip size package *2DSN1006-3 (1.0mm×0.6mm), which achieves miniaturization while reducing power consumption. Compared with ordinary products with the same package, the index indicating the relationship between on-off loss and on-off loss (on-off resistance *3×Qgd*4) has improved by about 20%, reaching the advanced level in the industry (comparison of packaged products under 1.0mm×0.6mm), which is very helpful to reduce the area of components on the circuit board of various small equipment and further improve the efficiency.

     In addition, ROHM's own packaging structure is used so that the side walls are protected by insulation (common products in the same package do not have insulation protection). In small devices where space constraints necessitate a high density of components, the use of this new product can contribute to the safe operation of the device by reducing the risk of short circuits caused by contact between components.