Pulse Electronics' top-in ICM with PiP design saves welding and layout time
Pulse Electronics' JX3V Series Pin impregnated Paste (PiP) jack-in Integrated Connector module (ICM) has a 0.9mm pitch that allows solder resistance and flux masks to be deposited or screen printed directly onto the PCB component side in the area directly below PulseJack. The series has 100% electrical and packaging compatibility with the existing JXD2 product line and can be used without recertification.
In addition to the voltage driven DSP, there is an additional 1 Gb option for current driven AFE PHY to support older styles. JX3V outperforms IEEE802.3ab for commercial and industrial Fast Ethernet (100 Mbps) and 1 Gb (1,000 Mbps) PHY, as well as industrial Ethernet protocols, including the latest TSN chipsets. These Pulsejacks are made from advanced heat-resistant plastics and rugged high-glass transition leds that can withstand reflux up to 3x +245°C and are fully RoHS6 and WEEE compliant.
Features
● Motor/servo control panel
● Embedded industrial Ethernet controller
● Instrument and measurement link
● Industrial remote access points and sensors
● Security and imaging systems
Applications
● Top access with/without LED
● 100% package and performance matching with the existing JXD2 family
● Covered by UL file E216117
● Operating temperature: -40°C to +85°C
● WAVE and IR reflow soldering with +260°C peak profile is supported
● LED options facilitate visual checks of connectivity or data rate
● More than EE802.3u/ab over a wide temperature range
● Available in coil or pallet form for high speed pickup
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