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New progress has been made in the development of 2D/3D dual-mode vision processing chips

Jan 15 2024 2024-01 Passive Components ON Semiconductor
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In recent years, with the rapid development of artificial intelligence and machine learning technology, vision processing chips are increasingly widely used in the field of computer vision. To meet the demand for higher performance and lower power consumption, researchers have been exploring new chip design and manufacturing techniques. In this regard, the company has made new progress in the development of 2D/3D dual-mode vision processing chips.

     In recent years, with the rapid development of artificial intelligence and machine learning technology, vision processing chips are increasingly widely used in the field of computer vision. To meet the demand for higher performance and lower power consumption, researchers have been exploring new chip design and manufacturing techniques. In this regard, the company has made new progress in the development of 2D/3D dual-mode vision processing chips.

     The 2D/3D dual-mode vision processing chip on which the semiconductor is located is a chip that integrates 2D and 3D vision processing functions, capable of simultaneously processing 2D images and 3D point cloud data. The development of this chip is of great significance for more accurate object recognition, scene understanding and depth perception.

     In terms of 2D image processing, the 2D/3D dual-mode vision processing chip of Semiconductor adopts advanced image processing algorithms and architectures, which can perform image alignment, edge detection, target detection and tracking functions. Through optimization algorithm and hardware design, the chip can realize fast and accurate image processing with low power consumption and high performance.

     In terms of 3D point cloud processing, the 2D/3D dual-mode vision processing chip of the Semiconductor Institute adopts deep learning algorithms and point cloud processing architecture, which can perform functions such as point cloud filtering, point cloud registration, point cloud segmentation and point cloud reconstruction. Through parallel computing and efficient memory access, the chip enables fast and accurate point cloud processing with low power consumption and high performance.

     In order to develop a 2D/3D dual-mode vision processing chip for semiconductors, researchers first need to design and optimize the chip's architecture and algorithms. Based on the requirements of 2D and 3D vision processing, the researchers propose a new chip architecture that can support both 2D image processing and 3D point cloud processing. In terms of algorithms, the researchers adapted traditional image processing algorithms and point cloud processing algorithms to the architecture and characteristics of the chip.

     Next, the researchers need to implement the design and manufacture of the chip. On the design side, researchers use modern chip design tools and processes to optimize the circuitry, layout, and timing of the chip. In terms of manufacturing, the researchers used advanced semiconductor manufacturing processes to perform mask manufacturing and package testing on the chip.

     Finally, the researchers need to test and verify the chip's performance. By using real 2D images and 3D point cloud data, researchers can evaluate the chip's performance and accuracy. During the testing and verification process, the researchers can also adjust and optimize the chip as needed.

     In general, the development of 2D/3D dual-mode vision processing chips in semiconductor companies is a complex and challenging process. By optimizing algorithms and hardware design, the researchers were able to achieve a vision processing chip with higher performance and lower power consumption. This will provide better solutions for applications in the field of computer vision and promote the development of artificial intelligence and machine learning technologies.

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