Molex introduces its first chip-to-chip 224G connector portfolio

Global electronics leader and connectivity innovator Molex has introduced the industry's first chip-to-chip 224G product portfolio, including next-generation cable, backplane, board to board connectors and Near-ASIC connector to cable solutions next to ASics with transmission speeds up to 224 Gbps-PAM4. As a result, Molex is uniquely positioned to meet the industry's higher demand for the fastest available data rates and, in turn, the growing demand for generative AI, machine learning (ML), 1.6T networking and other high-speed applications.

"Molex is actively preparing for the 224G product launch by working closely with key technology innovators as well as key data center and enterprise customers," said Jairo Guerrero, vice president and general manager of Molex Copper Solutions. "Our transparent co-development approach helps us reach out early to stakeholders in the 224G ecosystem to identify and address potential performance bottlenecks and design challenges, from signal integrity to electromagnetic interference reduction to more efficient thermal management."

Innovation in connectivity is driving the 224G ecosystem

Achieving data rates as high as 224 Gbps-PAM4 requires a new system architecture to enable multiple chip-to-chip connections, an important and complex technical inflection point. To this end, a cross-functional global team of Molex engineers works closely with customers, technology leaders and suppliers, leveraging the latest predictive analytics and advanced software simulation methods to accelerate the design and development of a full suite of best-in-class connectivity solutions, including:

● Mirror Mezz Enhanced Connector -- A new addition to the Mirror Mezz™ line of mature-free board-to-board connectors that can connect to 224 Gbps-PAM4 rate circuits while meeting different connection height requirements. It overcomes PCB space constraints and manufacturing and assembly challenges, resulting in lower application costs and shorter time-to-market.

The Mirror Mezz Enhanced connector extends the functionality of Mirror Mezz and Mirror Mezz Pro, These features were selected as Open Control Module (OCM) standards by the Open Accelerator Infrastructure Group within the Open Computing Project (OCP). This reinforces Molex's overall commitment to work with industry leaders to support the explosive growth of AI and other accelerator infrastructure systems.

● Inception™ Backplane Connector -- Molex's first backplane connection system designed from a cable-first perspective that does not differentiate between male and female connectors offers greater application flexibility from the outset, with variable terminal spacing (density), optimal signal integrity, and simplified integration with multiple system architectures. The introduction of simplified SMT technology reduces the need for complex PCB drilling and PCB interface through-hole processing. Molex offers a number of wire gauge options. You can choose the right wire gauge to match with the custom cable length inside and outside the application to optimize channel performance.

● CX2 Two-Speed Connector -- The 224 Gbps-PAM4 near-Asic connector from Molex provides strong and reliable connectivity to cable systems with rear screw locking, integrated stress relief, reliable mechanical friction travel and a fully protected "thumb-proof" docking interface. Long term reliable connection is ensured. High-performance dual coaxial cable and innovative shielding structure provide excellent isolation of Tx/Rx circuits.

● OSFP 1600 Solutions -- These I/O products include SMT connectors and covers, BiPass, and direct-connected cable (DAC) and active cable (AEC) solutions that achieve total speeds of 224 Gbps-PAM4 per channel or 1.6T per connector. Improved shielding devices minimize cross talk while improving signal integrity at higher Nyquist frequencies. These state-of-the-art connector and cable solutions are designed for increased mechanical robustness and durability.

● QSFP 800 and QSFP-DD 1600 solutions -- This family has also been upgraded to provide SMT connectors and shrouds, Bipass, and direct-connected cable (DAC) and active cable (AEC) solutions, Total connection speeds of 224 Gbps-PAM4 per channel or 1.6T per connector can be achieved. Molex's QSFP and QSFP-DD solutions ensure mechanical robustness, improve signal integrity, reduce heat load, increase design flexibility and reduce rack costs.