Microchip Technology's RT RTG4 fpga with lead-free flip chip bumps has achieved QML Class V status

     Microchip Technology's RT RTG4 fpga has lead-free flip chip bumps, which meet the mission assurance needs of the most critical space projects and have obtained QML Level V certification. As designated by the Defense Logistics Agency (DLA), QML Level V is the highest qualification level for space components and is a necessary step to meet mission assurance requirements for the most critical space missions, such as human ratings, deep space, and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements managed by DLA, customers can streamline their design and certification process by using QML qualified products.

     In 2018, the RTG4 fpga became the first RT fpga to deliver more than 150,000 logic elements to QML Level V qualification, and this next-generation solution with lead-free flip chip bump is the first of its kind to achieve QML Level V qualification. In advanced flip chip package architectures, such as the flip chip bump used in RTG4 FPGas, it is used to connect the silicon chip to the package substrate. Lead-free collision materials will help extend the life of products, which is critical for space missions.

     "This is another milestone for our RTG4 FPGA that will provide customers with greater confidence in designing these devices in space flight systems, while enabling them to take advantage of our high-reliability, zero-configuration interference and low-power FPgas," said Bruce Weyer, vice president of Microchip's FPGA business unit. "Microchip's solutions have been powering space flight missions for more than 60 years, and we are committed to product longevity and delivering the highest quality solutions."

     These FPGas are designed to bring high levels of density and performance to space applications, saving costs and engineering efforts through low power consumption and resistance to configuration interference. Unlike SRAM-based FPGA alternatives, the programming techniques used in RTG4 FPgas provide low static power, which helps manage thermal problems common in spacecraft.Compared to equivalent SRAM FPGas, these FPGas consume only a fraction of the total power while displaying zero configuration interference in radiation without mitigation, reducing engineering expenses and total system costs.

     To qualify for QML Class V, FPgas with lead-free bumps undergo extensive reliability testing, withstanding up to 2,000 thermal cycles at junction temperatures from -65 ° C to 150 ° C. The lead-free flip chip collision interface is connected to the MIL-PRF-38535 inspection standard with no sign of tin whisker. The flip chip bump is located inside the FPGA package, so there is no impact on the user's design, reflux curve, thermal management, or board assembly process when converting to a lead-free bump RTG4 FPGA.

     The company offers one of the industry's most comprehensive space portfolios of radiation and RT solutions, including QML Class Q RT PolarFire FPGas and sub-QML FPGas, bridging the gap between traditional QML components and COTS components. For a comprehensive list of Microchip FPGA and mixed-signal part numbers and their corresponding DLA drawing numbers, see the DLA Cross-Reference Guide.development kits, mechanical samples and Daisy chain packages for board validation and testing support FPgas. The Libero SoC Design Kit allows programmatic access to RTL and includes a rich IP library, complete reference design and development kit.