Littelfuse introduces four new families of transient suppression diode arrays

     Littelfuse, a global leader in circuit protection, offers four general purpose ESD protection Transient Suppression Diode Array (SPA® Diode) solutions that take up less board space than their industry counterparts. The SP1013 and SP1014 transient suppression diode arrays conform to standard 0201 package sizes, but require 30% less board space and greater gaps between components than other 0201 solutions. The SP1020 and SP1021 families feature the industry's smallest ESD protection package size, the 01005 flip chip, and have capacitance values nearly 78% lower than similar solutions in the industry.

     All four products are equipped with back-to-back Zener diodes to protect electronic devices that may be subject to damaging electrostatic discharge (ESD). The back-to-back configuration provides symmetric ESD protection for data or signal lines in the presence of AC signals. These diodes are powerful enough to safely absorb repeated ESD discharges at levels higher than the highest specified in the IEC 61000-4-2 international standard (level 4, ±8KV contact discharge) without worrying about their performance degradation.

     Applications for all four components include mobile phones, smartphones, digital cameras, wearables, tablets and portable devices. Tim Micun, Product Manager, Transient Suppression Diode Arrays, said: "These transient suppression diode arrays are designed to respond to the needs of customers in the wireless networking and wearable device industries who want both minimal package sizes and high levels of ESD protection performance. These products are highly immune to ESD and surge, helping to extend the life of the end products they form."