Infineon Technologies introduces two new power module platforms

     Infineon Technologies has announced two new power module platforms to enhance the performance of high-voltage IGBTs in the 1200V to 6.5kV voltage classes. To make the benefits of the new module more widely available, Infineon will offer a fee-free license to all IGBT power module manufacturers. The first products using the platform concept will include voltage classes of 3.3kV (450A), 4.5kV (400A) and 6.5kV (275 A), and feature new 100mm X 140mm X 40mm package design sizes. The new module will be unveiled during the PCIM show in Nuremberg, Germany, from May 19 to 21, 2015, while packages for lower voltage grades are being developed.

     High-performance and reliable IGBT modules are key technologies for industrial and traction drives, wind and photovoltaic, long-distance power transmission and other applications. After 30 years of development, chip technology has evolved to enable IGBTs to meet increasingly high energy efficiency and operating temperature requirements, while gradually miniaturizing, increasing reliability, and reducing cost, based on only limited improvements to standard packaging technology. However, in the face of increasingly demanding and harsh application environments, this approach has reached its limits, making the improvement of high-power module packaging technology a key factor in continuous performance improvement.

     The new module platform developed by Infineon meets current new system requirements such as high power density, high energy efficiency, long life cycle and high robustness. This flexible concept allows the same parts to be connected in parallel, thus simplifying the structure of DC bus terminals and capacitors. The AC terminals can be directly connected through only one bus. The flexibility and extensibility of this new module greatly simplifies system design, allowing developers to reduce the time needed to bring products from design to market. The new high-power modules feature the latest packaging technology, helping to reduce total system costs and ensure the future suitability of the design.

     Markus Hermwille, High Power Product Director, Industrial Power Control, Infineon Technologies AG, said: "Considering that IGBT technology is facing increasing challenges, we are very pleased to introduce a packaging technology that meets the current and foreseeable future industrial needs. We are quite certain that this new module package will bring great benefits to all demanding high-power applications. Our goal is to build a broad and reliable base by offering a new high-power platform, which is why we are inviting the industry to adopt this design."