Technology Articles
Datensätze 3.183
Seite 15/266

Samsung GDDR7: Redefining video memory technology to drive graphics processing
2025-01
Semiconductors
Samsung
[Jan 2 2025] In today's era of rapid technological development, the progress of video memory technology is crucial to improve the performance of graphics processing. Samsung Electronics, the world's semiconductor manufacturing giant, recently introduced their latest memory technology, GDDR7. This new generation of video memory, it is not simple, not only has a great breakthrough in performance, in energy effi ...

How modular design revolutionizes chip manufacturing: Benefits of Chiplet Technology
2025-01
Optoelectronics
Ametherm
[Jan 2 2025] Today, this technology is developing rapidly in the field of chip manufacturing, but it encounters both problems and opportunities. With the increasing demands on computing power, energy efficiency and cost effectiveness, the limitations of traditional monolithic integrated circuit (IC) design are gradually becoming apparent. In response to these worries, the concept of modular design was born, a ...

A new era of lithium battery welding: The rise of fast automatic spot welders
2025-01
Semiconductors
Adesto Technologies
[Jan 2 2025] Today we will talk about the new era of lithium battery welding, that is, the emergence of fast automatic spot welder! In the rise of electric vehicles and renewable energy markets today, the production and application of lithium batteries is becoming more and more critical! Consumers have increasingly high requirements for the safety, efficiency and cost of batteries, and traditional welding tec ...

Ultra-thin silicon wafers: the fundamental material of the semiconductor industry
2025-01
Semiconductors
Murata
[Jan 2 2025] Today, the semiconductor industry is developing rapidly, and the performance and efficiency of semiconductor components largely depend on what base materials are used. This ultra-thin silicon wafer is one of the key materials in semiconductor manufacturing and has become an important part of modern electronic devices and systems due to its special physical and chemical properties. The thickness o ...

The Guardian of modern car safety: Collision sensors
2024-12
Sensors
TDK
[Dez 31 2024] Nowadays, the automobile industry is developing rapidly, and safety has become a special point when we buy a car. With the continuous progress of science and technology, automobile manufacturers are also working hard to develop a variety of advanced safety systems, in order to allow drivers and cars to be safe. In this pile of technology, the collision sensor is the core of the modern car safety ...

STMicroelectronics launches new microprocessor to lead edge AI revolution
2024-12
Semiconductors
STMicroelectronics
[Dez 31 2024] Today, the development of science and technology can be called rapid, artificial intelligence (AI) is like the spring breeze blowing weeds, is drilling into various industries, promoting a variety of applications forward innovative development. STMicroelectronics, the global leader in semiconductor solutions, recently introduced this new microprocessor, which will have a major impact in the field ...

In the era of the Internet of Things, HMI reshapes the future of industrial touch screens
2024-12
Sensors
Abracon
[Dez 31 2024] How do iot and HMI combine? The core idea of the Internet of Things is to connect various devices through the Internet, so that data can be transmitted and processed in real time. In industrial Settings, HMI devices can be combined with sensors, controllers, and other devices to monitor and control the production process in real time. This connection not only makes the data more intuitive, but al ...

Elmos chips: The key to improving ultrasonic signal processing capabilities
2024-12
Sensors
Analog Devices
[Dez 31 2024] Now ultrasonic technology is very important in many industries, not without it! Like medical imaging, industrial testing, and automotive safety systems, the accuracy and speed of ultrasonic signal processing is directly related to the product's good performance and the user's satisfaction. In this case, Elmos chips are becoming increasingly critical as a high-performance signal processing method. ...

Glass substrates: Future solutions for semiconductor packaging
2024-12
Semiconductors
Infineon Technologies
[Dez 30 2024] Glass substrate is the future of semiconductor packaging light, now the rapid development of electronic technology, semiconductor components are more and more integrated, the size is getting smaller, which makes the need for high-performance materials more urgent. At this time, the glass substrate, with its unique nature, slowly become the semiconductor packaging industry. What are the characteri ...

From 2D to 3D: How is Hybrid bonding changing chip design
2024-12
Semiconductors
NDK
[Dez 30 2024] Chip design has undergone a major revolution. In the past, the traditional 2D chip design, although it has contributed a lot to the success of electronic products, and now the application needs are becoming more and more complex, it is a little confused and a little powerless. As a result, the idea of 3D chip design has slowly become mainstream, especially the Hybrid Bonding technology, which bri ...

The Engine for Intelligent Driving: The importance of system-level chips in cars
2024-12
Sensors
Weidmuller
[Dez 30 2024] Today, with the rapid development of the automobile industry, intelligent driving technology is like that runaway wild horse, changing the entire transportation ecosystem at an unprecedented speed. In this revolution, system-on-chip (SoC) is a very important driving force. It is not simple, it not only provides important computing and processing power to smart cars, but also plays an irreplaceabl ...

Airtight packaging technology: the key to chip protection
2024-12
Sensors
SiTIME
[Dez 30 2024] The use of electronic equipment is more and more widely, such as consumer electronics, industrial automation, communication, these fields, chip performance and reliability that is too important to the overall performance of the device. In order to make the chip run stably in a variety of difficult environments, this airtight packaging technology emerged and became one of the core technologies to ...