Schnittstelle - Telekommunikation
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KategorieHalbleiter / Schnittstellen-ICs / Schnittstelle - Telekommunikation
Datensätze 3.109
Seite 2/104
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Funktion | Schnittstelle | Anzahl der Schaltkreise | Spannung - Versorgung | Stromversorgung | Leistung (Watt) | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8DIP |
8.172 |
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- | Relay Switch | - | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
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Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN |
2.763 |
|
- | Ethernet | RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
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Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN |
23.616 |
|
- | Ethernet | RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
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Silicon Labs |
IC VOICE DAA SYSTEM SIDE 20TSSOP |
55.965 |
|
- | Direct Access Arrangement (DAA) | GCI, PCM, SPI | 1 | 3V ~ 3.6V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
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Microchip Technology |
IC TXRX DTMF 20SOIC |
61.254 |
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- | DTMF Transceiver | - | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
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Microchip Technology |
IC DSIC SUBSCRIBER NETWRK 24SSOP |
7.296 |
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- | Subscriber Line Interface Concept (SLIC) | - | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
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Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP |
16.560 |
|
ProSLIC® | Subscriber Line Interface Concept (SLIC), CODEC | PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
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Microchip Technology |
IC ETHERNET PHY QUAD 138QFN |
6.960 |
|
- | Signal Conditioner | - | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 138-QFN (12x12) |
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Microchip Technology |
IC ETHERNET DUAL PORT 256BGA |
8.298 |
|
- | Ethernet | - | 1 | 1V | - | - | - | Surface Mount | 256-BGA | 256-BGA |
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Maxim Integrated |
IC LIU T1/E1/J1 3.3V 44-TQFP |
23.544 |
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- | Line Interface Unit (LIU) | - | 1 | 3.135V ~ 3.465V | 66mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
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Microchip Technology |
IC TXRX ETHERNET OCTAL 444BGA |
7.032 |
|
- | Ethernet | Ethernet | 1 | - | - | - | - | Surface Mount | 444-BGA Exposed Pad | 444-BGA (27x27) |
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Microchip Technology |
IC ETHERNET 12-PORT 302TQFP |
9.168 |
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- | Ethernet | Ethernet | 1 | - | - | - | 0°C ~ 125°C | Surface Mount | 302-TQFP | 302-TQFP (24x24) |
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Microchip Technology |
DUAL GIGABIT IEEE 1588 10NS R/Q/ |
6.960 |
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- | Ethernet | RMII | 2 | 1V, 2.5V | - | - | - | Surface Mount | 256-BGA | 256-PBGA (17x17) |
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Microchip Technology |
IC SWITCH ETHERNET 12-PORT |
5.482 |
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- | Ethernet | - | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
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Microchip Technology |
IC DGTL SWITCH IDX 64X64 64MQFP |
8.160 |
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- | Switch | - | 1 | 4.5V ~ 5.5V | 10mA | - | -40°C ~ 85°C | Surface Mount | 64-BQFP | 64-MQFP (10x10) |
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Microchip Technology |
4P Q/SGMII CU/FI 3E, 4NS IND GE |
6.924 |
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* | - | - | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA |
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Microchip Technology |
DUAL 10G (R)-XAUI PHY WITH PREMI |
7.356 |
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- | Ethernet | SPI | 2 | 1V, 1.2V | - | - | - | Surface Mount | 196-LBGA, FCCSPBGA | 196-FCBGA (15x15) |
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Microchip Technology |
4P Q/SGMII CU/FI 3E, 256, 4NS CO |
6.984 |
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* | - | - | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
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Microchip Technology |
4P 10G WAN/LAN XFI-SFI MACSEC+15 |
9.036 |
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- | Ethernet | SPI | 4 | 970mV, 1.2V | - | - | - | Surface Mount | 256-BBGA, FCBGA | 256-FCBGA (17x17) |
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Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN |
5.274 |
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- | Driver | - | 1 | -5.5V ~ -4.9V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
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Microchip Technology |
IC DIGITAL SWITCH 32K CH 324BGA |
6.936 |
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- | Switch | - | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (19x19) |
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Microchip Technology |
26-PORT L2/L3 STACKABLE GIGABIT |
6.792 |
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SparX™-IV-44 | - | - | - | - | - | - | - | Surface Mount | 672-LBGA | 672-FCBGA (27x27) |
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Microchip Technology |
52-PORT L2/L3 STACKABLE GIGABIT |
5.238 |
|
SparX™-IV-80 | - | - | - | - | - | - | - | Surface Mount | 672-LBGA | 672-FCBGA (27x27) |
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Broadcom |
SERIAL 10-GIGABIT ETHERNET/FIBRE |
30.281 |
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* | - | - | - | - | - | - | - | - | - | - |
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Microchip Technology |
IC CNIC1.1 CLIP CID TYPE1 16SOIC |
7.464 |
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- | Telecom Circuit | 3-Wire | 1 | 2.7V ~ 5.5V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Microchip Technology |
IC ETHERNET 1-PORT 135QFN |
7.812 |
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- | Ethernet | Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
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IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SWITC 20SOIC |
9.096 |
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- | Line Card Access Switch | - | 2 | 3V ~ 3.6V | 4.5mA | - | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
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Microchip Technology |
IC HDLC PROTOCOL CTLR 28SOIC |
9.828 |
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- | Controller | - | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC DUAL PORT ETHERNET 135QFN |
3.598 |
|
- | Ethernet | Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
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Microchip Technology |
IC ECHO CANCELLER AEC 48TQFP |
14.484 |
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- | Echo Cancellation | Serial | 1 | 2.7V ~ 3.6V | 20mA | 90mW | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |