Microchip Technology Speicher
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KategorieHalbleiter / Speicher-ICs / Speicher
HerstellerMicrochip Technology
Datensätze 9.021
Seite 133/301
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Hersteller |
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Auf Lager |
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Serie | Speichertyp | Speicherformat | Technologie | Speichergröße | Speicherschnittstelle | Taktfrequenz | Schreibzykluszeit - Wort, Seite | Zugriffszeit | Spannung - Versorgung | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28TSOP |
3.546 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
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Microchip Technology |
IC EEPROM 512K SPI 20MHZ 8SOIC |
2.538 |
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- | Non-Volatile | EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 256K SPI 10MHZ 8DFN |
2.520 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
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Microchip Technology |
IC EEPROM 256K SPI 10MHZ 8DFN |
7.650 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32PLCC |
7.614 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32TSOP |
4.536 |
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- | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
6.246 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
289 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
8.550 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
51 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
4.619 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7.776 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
4.608 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
8.622 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7.452 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
1.339 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
4.644 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
2.700 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7.542 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3.696 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
1.974 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
6.660 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3.526 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
4.212 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
8.262 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
7.092 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
5.148 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
32 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
659 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
6.606 |
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- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |