MRDIMM's innovations deliver the highest performance and lowest latency

     Micron Technology, Inc. is currently sampling its MRDIMMs. mrdimm will enable its customers to run increasingly demanding workloads and derive maximum value from their computing infrastructure. For applications that require more than 128GB of memory per DIMM slot, these MRDIMMs accelerate memory-intensive virtualized multi-tenant, HPC, and AI data center workloads over current TSV RDIMMs by providing the highest bandwidth, maximum capacity, and lowest latency as well as improved performance per watt. The new memory products are the first generation of the family and will be compatible with Intel Xeon 6 processors.

     "Micron's latest innovative primary storage solution, MRDIMM, delivers much-needed bandwidth and capacity with lower latency to scale AI inference and HPC applications on next-generation server platforms," said Praveen Vaidyanathan, vice president and general manager of Micron's Computing Products group. "Mrdimms significantly reduce energy consumption per task while providing the same reliability, availability, maintainability and interface as RDIMMs, giving customers a flexible solution that scales performance." Micron's close industry collaboration ensures seamless integration with existing server infrastructure and a smooth transition to future computing platforms."

     By implementing DDR5 physical and electrical standards, MRDIMM technology delivers memory advancements that allow bandwidth and per-core capacity to scale to future-proof computing systems and meet the growing demands of data center workloads.

     Mrdimms support standard and High Specification (TFF) capacity ranges from 32GB to 256GB for high-performance 1U and 2U servers. The improved TFF module cooling design reduces DRAM temperatures by up to 20 ° C at the same power and air flow, providing more efficient cooling capabilities for data centers and optimizing overall system task energy for memory-intensive workloads. The company uses industry-leading memory design and process technology from 32Gb DRAM chips to enable 256GB TFF MRDIMMs to have the same power package as 128GB TFF MRDIMMs using 16Gb chips. At maximum data rates, 256GB TFF MRDIMMs deliver 35% better performance than TSV RDIMMs of the same capacity. With 256GB TFF MRDIMMs compared to TSV RDIMMs, data centers can gain unprecedented TCO advantages.

     "By leveraging DDR5 interfaces and technology, mrdimm can be seamlessly compatible with existing Xeon 6 CPU platforms, providing customers with flexibility and choice," said Matt Langman, vice president and general manager of Xeon 6 data center product management at Intel. "mrdimm offers customers a comprehensive choice of capacity points for higher bandwidth, lower latency and high performance computing, artificial intelligence and large workloads, all on the same Xeon 6 CPU platform that supports standard DIMMs. Our customers will benefit from Micron's broad mrdimm portfolio, from 32GB to 256GB in density, standard and high size, which will be validated on the Intel Xeon 6 platform."

     "As processor and GPU vendors have provided us with exponentially more cores, the memory bandwidth needed to deliver balanced system performance has lagged. The Micron mrdimm will help close the bandwidth gap for memory-intensive workloads such as AI inference, AI retraining and countless HPC workloads, "said Scott Thies, vice president and general manager of AI and HPC at Lenovo. "We are working more closely with Micron than ever before and are focused on delivering balanced, high-performance, sustainable technology solutions to our mutual customers."