Intel's contract manufacturing business and Arm announced a partnership

      Intel Foundry Services (IFS) and Arm announced the signing of a multi-generation leading-edge system chip design. The agreement is designed to enable chip designers to leverage Intel 18A processes to develop low-power computing system-level chips (SoCs). The collaboration will initially focus on the design of mobile system-level chips and is expected to expand to automotive, Internet of Things, data centers, aviation and government applications in the future. Arm® customers will benefit from superior Intel 18A process technology when designing the next generation of mobile system-level chips, which enables new and groundbreaking transistor technology that effectively reduces power consumption and improves transistor performance. At the same time, they will also benefit from the strong manufacturing capabilities of Intel Foundry Services.

     Pat Gelsinger, chief executive of Intel, said: "The digitisation of everything is driving an increasing need for computing power. But until now, semiconductor design companies have had limited options when it comes to using the most advanced mobile technology for chip design. "Intel's partnership with Arm will create more market opportunities for Intel's foundry services and provide semiconductor design companies with new options and ways to access best-in-class CPU IP and open system-level foundry with cutting-edge process technology."

     "Arm's secure, power efficient processors are at the heart of hundreds of billions of devices and experiences in the digital world," said Rene Haas, Chief Executive Officer of Arm. As the demands for computing and efficiency become more sophisticated, the industry needs to keep innovating on all fronts. "As Arm technology is enabling the next generation of world-changing products, this partnership with Intel will help Intel Foundry Services become an important foundry partner for our customers."

     Part of Intel's IDM 2.0 strategy is to invest in leading manufacturing capacity around the world to meet sustained and long-term chip demand. This collaboration will provide a resilient global supply chain for OEM customers engaged in mobile SoC design based on Arm CPU cores. By unlocking Arm's portfolio of cutting-edge computing products and world-class IP through Intel Processes, Arm's partners will be able to take full advantage of Intel's open system-level foundry model that covers not only traditional wafer manufacturing, but also packaging, software and cores.

     Intel Foundry Services and Arm will conduct collaborative design process optimization (DTCO). Chip design and manufacturing processes will be optimized together to improve power consumption, performance, area, and cost (PPAC) of the Arm kernel for Intel's 18A process technology. Intel 18A offers two breakthrough technologies -- PowerVia for optimized power delivery and RibbonFET, an all-surround grid (GAA) transistor architecture for optimized performance and power consumption.

     Intel Foundry Services and Arm will develop a mobile reference design to demonstrate software and systems knowledge to foundry customers. As the industry evolves from design process Collaborative Optimization (DTCO) to System process Collaborative optimization (STCO), Arm and Intel Foundry Services will work together to leverage Intel's unique open system-level foundry model to optimize applications and software platforms through packaging and chips.