Congatec has introduced new COM Express Compact COMs with AMD Ryzen Embedded 8000 Series processors

     Congatec has introduced the new COM Express compact COMs with AMD Ryzen Embedded 8000 series processors. Based on the dedicated compute core of the new Ryzen processor, which features up to eight "Zen 4" cores, innovative XDNA NPU, and powerful Radeon RDNA 3 graphics, the new module delivers impressive performance of up to 39 tera operations per second (TOPS) for AI reasoning.

     This makes the new conga-TCR8 Type 6 module particularly attractive for high-volume, price-sensitive applications that require a combination of advanced artificial intelligence, graphics, and computing power. Oems in medical imaging, test measurement, AI-enabled POS/POI systems, and professional gaming can use these long-available COM Express Compact modules to accelerate innovation while ensuring investment security. With a widely scalable TDP range of 15W to 54W, these modules are also ideal for upgrading existing designs. Companies can bring their products into the latest state of the art by simply replacing modules, greatly improving life cycle, ROI, and sustainability.

     "Our new AMD Ryzen Embedded 8000 based modules not only extend the scope of our high-performance edge AI platform for innovative applications, but also provide developers with easy access to the system integration benefits of aReady.COM variants." This new processor platform, with its powerful CPU, GPU, and NPU cores, is ideal for this kind of integration. Martin Danzer, Director of Product Management at Congate, explains: "With the hypervisor configured, the operating system pre-installed, the accompanying iot software with enhanced functionality, and flexible expansion options, customers and users can benefit from cost, efficiency and reliability advantages."

     The new com has four different AMD Ryzen Embedded 8000 processors with six or eight "Zen 4" cores. They support up to 128GB of DDR5-5600 memory and ECC for data-intensive and data-critical applications. The integrated AMD XDNA NPU (16 TOPS) and AMD Radeon RDNA 3 graphics can also be used as GPGpus for AI tasks of up to 12 compute units, providing combined compute power of up to 39 TOPS. They also support immersive graphics output from up to four monitors with resolutions up to 8k. They offer 6 PCIe Gen 4(8 channels) for fast peripheral connectivity with PEG x8 Gen 4, 3 DisplayPort ports, 1 eDP or LVDS, 4 USB 3.2 Gen 2 ports, and 4 USB 2.0 ports. Audio signals are transmitted via HAD, and mass storage can be integrated directly via two 6Gb/s SATA ports on the module or an optional NVMe SSD. Classic embedded interfaces such as SPI, UART, I2C and GPIO complete the feature set.

     The new module is also ready as an application. com, with custom pre-installed and verified operating systems such as ctrlX OS, Ubuntu and/or RT Linux, system integration is available through aReady. VT and iot are connected via ready.IoT. Upon request, these modules can be pre-installed in the customer's application, enabling simple plug and play integration into the finished system.

     In addition, the company's high-performance ecosystem and design services streamline the application development process. Service offerings include comprehensive board support packages, evaluation and production-ready application carrier boards, custom cooling solutions, extensive documentation and training, and high-speed signal integrity measurement.