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Technology Articles

Datensätze 2.884
Seite 231/241
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NXP builds mobile ticketing capabilities for smart mobile devices

2012-04 Semiconductors NXP
[Apr 22 2012] NXP Semiconductors announced the launch of the Java Applet for MIFARE4Mobile, which will be installed in NXP's latest embedded security component to provide mobile ticketing support for a significant number of MIFARE Classic systems worldwide. The solution is now available in NXP's latest NFC solution, the PN65O, which integrates NXP's popular PN544 NFC controller and the newly enhanced SmartMX P ...
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NXP introduces RFCMOS single-chip car radio Solution

2012-04 Semiconductors NXP
[Apr 21 2012] NXP Semiconductors announced the TEF664x, adding to its highly successful family of RFCMOS single-chip car radio solutions. The TEF664x integrates a low IF AM/FM tuner and DSP processing unit in a single chip and is specifically designed for single tuner applications. Oems and car radio manufacturers around the world, especially in the BRIC countries (Brazil, Russia, India, China), require highly ...
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Microchip Technology announced the launch of its next generation Power Metering Analog Front End (AFE)

2012-04 Connectors Microchip Technology
[Apr 20 2012] Microchip Technology announced the launch of its next generation electric Energy Metering Analog Front End (AFE), the MCP3911. The device features two 24-bit Delta-Sigma analog-to-digital converters (ADCs) that operate at 3V, providing industry-leading accuracy: 94.5dB SINAD and 106.5dB THD. By accurately measuring from start-up to maximum current, the device provides improved watt-hour meter and ...
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Renesas Electronics introduces eight low-power MOSFETs

2012-04 Connectors Renesas Electronics America
[Apr 19 2012] Renesas Electronics Corporation announced the launch of eight low-power P-channel and N-channel power metal oxide semiconductor field-effect transistor (MOSFET) products, ideal for use in portable electronics including smartphones and notebooks. Featuring industry-leading low power consumption (low on-resistance), the new devices include 20 V (VDSS) µPA2600 and 30 V µPA2601 in an ultra-compact 2 ...
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IDT introduces temperature sensor for solid state drives

2012-04 Sensors IDT, Integrated Device Technology
[Apr 18 2012] IDT Corporation announced the launch of a new line of precision temperature sensors for ultra-low power solid-state drive applications. The new device family minimizes power consumption, optimizes bill of materials (BOM), and remains compatible with existing standards for high-capacity memory modules. The IDT TS3000GB0A0 is a low-power, high-precision temperature sensor for enterprise server and ...
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Xilinx Display Target Design Platform accelerates development of ultra-high resolution 4K2K displays

2012-04 Power Xilinx
[Apr 17 2012] Xilinx announced at the National Broadcast Television Equipment Show (NAB) the Display Target Design Platform (TDP) based on the ACDC (Capture, Provide, Distribute, Consume) 1.0 hardware platform from Tokyo Electronic Devices Co., LTD. (TED), a senior member of the Xilinx Alliance Program. Display TDP significantly accelerates the development of 4K2K displays and high-resolution projection system ...
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Renesas Electronics introduces smart power devices targeted for automotive applications

2012-04 Power Renesas Electronics America
[Apr 16 2012] Renesas Electronics has announced 14 new Intelligent Power devices (IPDs), including the μPD166023, designed for automotive applications to drive external lights such as headlights and fog lamps, as well as seat heaters and motors. IPD is a power IC device integrated into a single package or a single chip. The power semiconductor switch (power metal oxide semiconductor field-effect transistor (MO ...
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Microsemi showcases many of the latest products and solutions

2012-04 Power Microsemi
[Apr 15 2012] Microsemi highlights a range of products and solutions including: ZL70250 Ultra-low power Radio frequency (RF) transceiver, Power conversion technology for solar/photovoltaic inverters, demonstration of new single-chip multi-axis motor control suite from Meko SEMi, Flangeless VRF MOSFETs and the new 1200V IGBT series and high reliability Transient Voltage suppression (TVS) products. Among the mos ...
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STMicroelectronics introduces energy efficient voltage comparator

2012-04 Connectors STMicroelectronics
[Apr 14 2012] STMicroelectronics introduces a wide range of voltage comparators. With the same response time, the rated operating current of ST's new products is one-third that of similar products on the market (e.g. LMV331). The market demands greater energy efficiency and longer battery life in portable electronic devices, and ST's latest voltage comparator is designed to meet this requirement, in line with ...
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Vishay introduces new AEC-Q200 certified thin film resistance networks

2012-04 Passive Components Vishay
[Apr 13 2012] Vishay Intertechnology has announced the launch of a new family of AEC-Q200 certified dual-circuit thin film resistance networks, the NOMCA series. The series features an absolute TCR as low as ±25ppm/ ° C, a TCR tracking of 5ppm/ ° C, a strict ratio tolerance of ±0.05%, and a long-term ratio stability of 0.05% after 1000 hours of operation at +125 ° C. In order to improve ESD and moisture resist ...
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NXP introduces new UHF card reader chips for electronic devices and consumer markets

2012-04 Semiconductors NXP
[Apr 12 2012] NXP Semiconductors announced the launch of its latest RFID product - a low-cost UHF card reader chip designed specifically for the electronic devices and FMCG markets. To enhance the consumer experience and combat counterfeiting, a growing number of manufacturers are integrating RFID solutions into products ranging from printers to beverage vending machines. RFID readers can identify consumables ...
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Vishay announces a series of ultra-low profile infrared receivers with a thickness of only 0.8mm for remote controls

2012-04 Passive Components Vishay
[Apr 11 2012] Vishay Intertechnology has expanded its optoelectronics portfolio with the TSOP57x series, a remote control receiver with the industry's best size and light Angle. The new TSOP57x series includes TSOP572... TSOP573... TSOP574... And TSOP575... The device, with an ultra-thin thickness of 0.8mm, is one of the thinnest products on the market today, with a photosensitive Angle of an astonishing 150°. ...