Technology Articles
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Microsemi introduces automotive grade SoC FPgas and FPGA devices
2015-08
Semiconductors
Microsemi
[Aug 2 2015] Microsemi Corporation announced the availability of new automotive-grade field-programmable gate array (FPGA) and system-on-chip (SoC) FPGA devices. The next generation of flash-based, low-power FPGas and ARM® Cortex-M3 enabling SoC FPGA devices have received AEC-Q100 Level 2 certification, an industry standard specification that Outlines standards for electronic components to ensure that the fin ...
Ams has announced the selection of the ams AS-MLV-P2MEMS volatile organic Compounds gas sensor for Elgato's new Eve Smart Home monitoring product.
2015-08
Sensors
ams
[Aug 1 2015] Ams announced the selection of the ams AS-MLV-P2MEMS Volatile Organic Compounds gas sensor for its new Eve Smart Home monitoring product Elgato. Measuring 9.1mm x 9.1mm x 4.5mm, AS-MLV-P2 is a low-power gas sensor that accurately measures the concentration of volatile organic compounds in the surrounding air. The device can accurately take different adjustment measures according to the level of c ...
TDK introduces a new EPCOS NTC sensor element
2015-07
Connectors
TDK
[Jul 31 2015] TDK Group introduces a new EPCOS NTC sensor element designed for measuring high temperatures up to 650 °C. The element is based on a high temperature ceramic sensor element, connected to a metallized alumina rod and then enclosed in glass, with high measurement accuracy and a temperature tolerance of only ±1 K at 200 °C. Thanks to the glass package, the new component is extremely robust. The new ...
STMicroelectronics introduces the new M-Series 650V IGBT
2015-07
Connectors
STMicroelectronics
[Jul 30 2015] STMicroelectronics introduces the new M-Series 650V IGBT to provide power designers with a faster and more economical energy efficiency solution. Suitable for HVAC motor drives, uninterruptible power supplies, solar converters, and all hard-switching circuit topologies for 20kHz power conversion applications. Using ST's third generation trench-gate field-stop low loss manufacturing process, the M ...
Diodes introduces four multi-function doors that can be configured with custom logic
2015-07
Power
Diodes Incorporated
[Jul 29 2015] Diodes introduces four multifunction gates that can be configured with custom logic to replace multiple devices with a single component. The new products add functionality to the company's existing 74AUP1G logic device family and provide space and weight savings for space-constrained applications, including wearable fitness devices, smartphones and other portable consumer electronics. 74AUP1G57, ...
Altera showcases single-chip configurable processor capabilities in its latest MAX 10 FPGA suite
2015-07
Power
Altran Magnetics
[Jul 28 2015] Altera Corporation announced the availability of the second-generation Nios II Embedded Evaluation Kit (NEEK), which installs Altera's non-volatile MAX 10 FPGA along with the Nios II soft-core embedded processor. The MAX 10 NEEK is a feature-rich platform that provides an easy and convenient way for embedded designers to experience custom embedded processor capabilities with non-volatile FPgas. T ...
CSR introduces the Quatro 5500, an integrated system-on-chip
2015-07
Power
Cree Inc.
[Jul 27 2015] CSR Corporation today announced the Quatro 5500, an integrated system-on-chip (SOC) to further enrich its printer SOC product line to enable seamless connectivity between a new generation of workgroup multifunction printers (MFPS) and mobile devices, the cloud, traditional PCS and servers for fast, high-quality printing. The Quatro 5500 series provides a low-cost SOC alternative to traditional MF ...
Microchip has released two new families of 8-bit PIC microcontrollers
2015-07
Connectors
Microchip Technology
[Jul 26 2015] Microchip announced two new families of 8-bit PIC® microcontrollers at the Embedded Systems Expo (ESC Silicon Valley), expanding its growing portfolio of innovative PIC MCUS with kern-independent peripherals (CIPs). The new family combines more intelligent, interconnected CIPs to enable autonomous functional operation without kernel intervention, making it widely used. Because these functions ope ...
New high performance low voltage differential regulator according to the Automotive Electronics AEC-Q100 standard
2015-07
Semiconductors
Microwave Technology Inc.
[Jul 25 2015] Micrel, the industry leader in high-performance linear and power solutions, local area networks, and clock management and communications solutions, introduces a new high-performance low-voltage differential regulator (LDO) compliant with the automotive electronics AEC-Q100 standard, with an ultra-low pressure differential of just 100 millivolts at 300 mA. The MAQ5300 comes in a small DFN package ...
Vishay introduces two SurfLight high-speed infrared light-emitting diodes
2015-07
Passive Components
Vishay
[Jul 24 2015] Vishay has introduced two SurfLight high-speed infrared light-emitting diodes, VSMY12850 and VSMY12940, in a small 3.2mm x 1.6mm x 1.1mm top-view SMD package, expanding its optoelectronics portfolio. Vishay Semiconductors 850nm VSMY12850 and 940nm VSMY12940 are based on Vishay's GaAIAs surface emitter chip technology with high radiation intensity and light power, as well as fast switching times. ...
Diodes introduces a pair of dual N-channel enhanced MOSFETs DMN2014LHAB and DMN2011UFX
2015-07
Connectors
Diodes Incorporated
[Jul 23 2015] Diodes Inc. introduces a pair of dual N-channel enhanced MOSFETs DMN2014LHAB and DMN2011UFX to provide a compact bidirectional low loss switch for battery charging circuits. The target end markets for the new products include single-cell and dual-cell lithium battery chargers used in portable products such as smartphones, tablets, cameras and media players. DMN2014LHAB and DMN2011UFX are equipped ...
Ams introduces the new TMx4903 series of advanced optical sensor modules
2015-07
Optoelectronics
ams
[Jul 22 2015] Ams introduces the new TMx4903 Series of advanced optical sensor modules that integrate universal remote control, barcode simulation, RGB color sensing, proximity sensing and 3D gesture detection in a package size of only 5.0x2.0x1.0mm. The highly integrated TMx4903 module reduces the need for board space size to meet the new features of today's smartphones while significantly reducing material c ...