Schnittstelle - Telekommunikation
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KategorieHalbleiter / Schnittstellen-ICs / Schnittstelle - Telekommunikation
Datensätze 3.109
Seite 98/104
Bild |
Teilenummer |
Hersteller |
Beschreibung |
Auf Lager |
Menge |
Serie | Funktion | Schnittstelle | Anzahl der Schaltkreise | Spannung - Versorgung | Stromversorgung | Leistung (Watt) | Betriebstemperatur | Montagetyp | Paket / Fall | Lieferantengerätepaket |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE |
2.898 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
155 MBIT/S ATM AND PACKET-OVER-S |
3.492 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
20G VT/TU SWITCHING ELEMENT |
2.214 |
|
- | SONET/SDH | Serial | 1 | - | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
|
|
Microchip Technology |
32 LINK, 672 HDLC CHANNEL FRAME |
3.132 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
33 LINK, 672 HDLC CHANNEL FRAME |
4.842 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
TEMUX 336NG, PB FREE BUMP |
2.538 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE |
2.448 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
DUAL 10G XFI/SFI PHY WITH PREMIU |
8.964 |
|
* | - | - | - | - | - | - | - | Surface Mount | 256-BBGA | 256-FCBGA (17x17) |
|
|
Maxim Integrated |
IC TXRX T1/E1/J1 100CSBGA |
7.254 |
|
- | Single-Chip Transceiver | E1, HDLC, J1, T1 | 1 | 3.135V ~ 3.465V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
|
|
Maxim Integrated |
IC LIU QUAD 256CSBGA |
6.210 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
Maxim Integrated |
IC LIU QUAD 144CSBGA |
917 |
|
- | Line Interface Unit (LIU) | LIU | 4 | 3.135V ~ 3.465V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
8.316 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
8.784 |
|
- | Ethernet | PCI | 2 | - | - | - | - | Surface Mount | 300-BGA | 300-HBGA |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
6.984 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
2.574 |
|
- | Ethernet | PCI | 2 | - | - | - | - | Surface Mount | 676-BGA | 676-PBGA (27x27) |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
4.536 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
3.441 |
|
- | Ethernet | PCI | 1 | - | - | - | - | - | - | - |
|
|
Microchip Technology |
MODULE SONET/SDH |
6.606 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
MODULE SONET/SDH |
2.304 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
MODULE SONET/SDH |
3.204 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
MODULE SONET/SDH |
5.130 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Maxim Integrated |
IC LIU 6PORT SMD |
6.588 |
|
- | Line Interface Unit (LIU) | LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | - | - | - |
|
|
Broadcom |
DOCSIS EOC MAC |
7.560 |
|
- | C-DOCSIS MAC Chip | SFI | - | - | - | - | 0°C ~ 85°C (TJ) | - | - | - |
|
|
Broadcom |
DOCSIS EOC |
482 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
DOCSIS EOC |
7.146 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Silicon Labs |
IC ISOMODEM SYSTEM-SIDE 24TSSOP |
8.370 |
|
ISOmodem® | Direct Access Arrangement (DAA) | Parallel, SPI, UART | 1 | 3V ~ 3.6V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Broadcom |
DATA MODEM |
4.428 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
SWITCH 100GE-3X 40GE |
5.076 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
ETH SWITCH 24FE 4X2.5G MULTILAYE |
3.006 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
Broadcom |
ETH SWITCH 24FE 4X2.5G MULTILAYE |
8.010 |
|
- | - | - | - | - | - | - | - | - | - | - |