EPC2107ENGRT Datenblatt
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Hersteller EPC Serie eGaN® FET-Typ 3 N-Channel (Half Bridge + Synchronous Bootstrap) FET-Funktion GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss) 100V Strom - Kontinuierliche Entleerung (Id) bei 25 ° C. 1.7A, 500mA Rds On (Max) @ Id, Vgs 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Vgs (th) (Max) @ Id 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs 0.16nC @ 5V, 0.044nC @ 5V Eingangskapazität (Ciss) (Max) @ Vds 16pF @ 50V, 7pF @ 50V Leistung - max - Betriebstemperatur -40°C ~ 150°C (TJ) Montagetyp Surface Mount Paket / Fall 9-VFBGA Lieferantengerätepaket 9-BGA (1.35x1.35) |
Hersteller EPC Serie eGaN® FET-Typ 3 N-Channel (Half Bridge + Synchronous Bootstrap) FET-Funktion GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss) 100V Strom - Kontinuierliche Entleerung (Id) bei 25 ° C. 1.7A, 500mA Rds On (Max) @ Id, Vgs 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Vgs (th) (Max) @ Id 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs 0.16nC @ 5V, 0.044nC @ 5V Eingangskapazität (Ciss) (Max) @ Vds 16pF @ 50V, 7pF @ 50V Leistung - max - Betriebstemperatur -40°C ~ 150°C (TJ) Montagetyp Surface Mount Paket / Fall 9-VFBGA Lieferantengerätepaket 9-BGA (1.35x1.35) |
